Tianwei Sun

Follow

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
- Patent number 11,616,040
- Issue date Mar 28, 2023
- NXP USA, INC.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages containing peripherally-encapsulated dies...
- Patent number 11,128,268
- Issue date Sep 21, 2021
- NXP USA, INC.
- Sharan Kishore
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor dies having ultra-thin wafer backmetal systems, micro...
- Patent number 10,923,451
- Issue date Feb 16, 2021
- NXP USA, INC.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented field plate structure
- Patent number 9,893,156
- Issue date Feb 13, 2018
- NXP USA, INC.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented field plate structure
- Patent number 9,647,075
- Issue date May 9, 2017
- NXP USA, INC.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
- Publication number 20210167033
- Publication date Jun 3, 2021
- NXP USA, Inc.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICRO...
- Publication number 20210020595
- Publication date Jan 21, 2021
- NXP USA, Inc.
- Tianwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED FIELD PLATE STRUCTURE
- Publication number 20170200794
- Publication date Jul 13, 2017
- NXP USA, Inc.
- JENN HWA HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED FIELD PLATE STRUCTURE
- Publication number 20170077245
- Publication date Mar 16, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Jenn Hwa Huang
- H01 - BASIC ELECTRIC ELEMENTS