Tianyi Gao

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Full system self-regulating architecture
- Patent number 12,193,197
- Issue date Jan 7, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Side fluid cooling apparatus for server racks
- Patent number 12,178,020
- Issue date Dec 24, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Containment system for electronics racks
- Patent number 12,150,268
- Issue date Nov 19, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic rack fluid distribution system
- Patent number 12,127,372
- Issue date Oct 22, 2024
- BAIDU USA LLC
- Shuai Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-availability liquid cooling system for chip and server
- Patent number 12,114,468
- Issue date Oct 8, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server memory array cooling hardware
- Patent number 12,108,566
- Issue date Oct 1, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High cooling efficiency data center including different server clus...
- Patent number 12,096,604
- Issue date Sep 17, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management device for high density processing unit
- Patent number 12,089,370
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-phase system in server cluster
- Patent number 12,082,373
- Issue date Sep 3, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prefabricated module for heterogeneous data centers
- Patent number 12,082,380
- Issue date Sep 3, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enclosure for electronic device with liquid cooling
- Patent number 12,058,837
- Issue date Aug 6, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component package for high power ASIC thermal management
- Patent number 12,057,368
- Issue date Aug 6, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy-generating fluid distribution module for servers
- Patent number 12,048,126
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IT cooling enclosures for energy storage backup systems
- Patent number 12,048,117
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy storage cell packaging and system with acceleration design
- Patent number 12,046,730
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distribution hardware for two phase system recirculation
- Patent number 12,048,127
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid connection apparatus for servers and racks
- Patent number 12,041,750
- Issue date Jul 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling plate with coaxial fluid port
- Patent number 12,029,013
- Issue date Jul 2, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sectional architecture for fluid management and leakage sensors
- Patent number 12,013,193
- Issue date Jun 18, 2024
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip to server packaging design for immersion systems
- Patent number 12,010,815
- Issue date Jun 11, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center multi-stage backup system
- Patent number 11,996,708
- Issue date May 28, 2024
- BAIDU USA LLC
- Tianyi Gao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Connector alignment design for servers
- Patent number 11,997,831
- Issue date May 28, 2024
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Current detection based renewable energy system for a data center
- Patent number 11,990,757
- Issue date May 21, 2024
- BAIDU USA LLC
- Tianyi Gao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Battery power management for a battery backup unit (BBU) shelf
- Patent number 11,978,913
- Issue date May 7, 2024
- BAIDU USA LLC
- Huawei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density server chassis packaging
- Patent number 11,980,008
- Issue date May 7, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak segregation and detection system for an electronics rack
- Patent number 11,980,006
- Issue date May 7, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling distribution unit for electronic racks
- Patent number 11,980,007
- Issue date May 7, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two phase immersion system with local fluid accelerations
- Patent number 11,968,803
- Issue date Apr 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak detection and prevention system
- Patent number 11,960,335
- Issue date Apr 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION TECHNOLOGY (IT) ENCLOSURE FOR BATTERY BACKUP SYSTEMS
- Publication number 20230387506
- Publication date Nov 30, 2023
- BAIDU USA LLC
- TIANYI GAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVER AND COOLING SYSTEM FOR ENHANCED IMMERSION COOLING
- Publication number 20230389230
- Publication date Nov 30, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER RACK COOLING SYSTEM ARCHITECTURE
- Publication number 20230371202
- Publication date Nov 16, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIDE FLUID COOLING APPARATUS FOR SERVER RACKS
- Publication number 20230354560
- Publication date Nov 2, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR HIGH DENSITY PROCESSING UNIT
- Publication number 20230320034
- Publication date Oct 5, 2023
- BAIDU USA LLC
- TIANYI GAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACTLESS DEVICE AND CHIP THERMAL MANAGEMENT PLATE
- Publication number 20230309269
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE COOLING APPARATUS FOR BATTERY BACKUP UNITS
- Publication number 20230307737
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER DENSITY CHIPS BASED TWO-PHASE LOOP RECIRCULATION
- Publication number 20230309263
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH COOLING EFFICIENCY DATA CENTER INCLUDING DIFFERENT SERVER CLUS...
- Publication number 20230309271
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-AVAILABILITY LIQUID COOLING SYSTEM FOR CHIP AND SERVER
- Publication number 20230309270
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER BATTERY CLUSTER WITH IMMERSION SYSTEM
- Publication number 20230299375
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON A CHIP BASED COOLING SYSTEM
- Publication number 20230301019
- Publication date Sep 21, 2023
- BAIDU USA LLC
- TIANYI GAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLOW RATE SENSING SYSTEM FOR LIQUID COOLANT FLOW MANAGEMENT OF AN I...
- Publication number 20230301027
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER MEMORY ARRAY COOLING HARDWARE
- Publication number 20230301022
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE SYSTEM IN SERVER CLUSTER
- Publication number 20230301024
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISTRIBUTION HARDWARE FOR TWO PHASE SYSTEM RECIRCULATION
- Publication number 20230301037
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER PACKAGING FOR IMMERSION COOLING WITH LOCAL ACCELERATION
- Publication number 20230301035
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TO SERVER PACKAGING DESIGN FOR IMMERSION SYSTEMS
- Publication number 20230301020
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY SERVER CHASSIS PACKAGING
- Publication number 20230301021
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IT COOLING ENCLOSURES FOR ENERGY STORAGE BACKUP SYSTEMS
- Publication number 20230292465
- Publication date Sep 14, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY STORAGE UNIT WITH INTEGRATED TWO-PHASE COOLING
- Publication number 20230291031
- Publication date Sep 14, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID CONNECTION APPARATUS FOR SERVERS AND RACKS
- Publication number 20230284415
- Publication date Sep 7, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER RACK USING A PASSIVE INTERNAL RETURN LOOP FOR TWO-PHASE FLUI...
- Publication number 20230276602
- Publication date Aug 31, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENERGY STORAGE CELL PACKAGING AND SYSTEM WITH ACCELERATION DESIGN
- Publication number 20230268578
- Publication date Aug 24, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK DESIGN FOR PHASE CHANGE MANAGEMENT
- Publication number 20230238611
- Publication date Jul 27, 2023
- BAIDU USA LLC
- Tianyi GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND SYSTEM FOR HYBRID MULTI-PHASE SERVER COOLING
- Publication number 20230240051
- Publication date Jul 27, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING WITH SERIAL CONDE...
- Publication number 20230217630
- Publication date Jul 6, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR SINGLE PHASE IMMERSED SERVERS
- Publication number 20230217625
- Publication date Jul 6, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING
- Publication number 20230209774
- Publication date Jun 29, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISTRIBUTION AND MANAGEMENT COOLING SYSTEM FOR IMMERSION LIQUID COO...
- Publication number 20230209781
- Publication date Jun 29, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Full system self-regulating architecture

Side fluid cooling apparatus for server racks

Containment system for electronics racks

Electronic rack fluid distribution system

High-availability liquid cooling system for chip and server

Server memory array cooling hardware

High cooling efficiency data center including different server clus...

Server and cooling system for enhanced immersion cooling

Thermal management device for high density processing unit

Two-phase system in server cluster

Prefabricated module for heterogeneous data centers

Enclosure for electronic device with liquid cooling

Component package for high power ASIC thermal management

Energy-generating fluid distribution module for servers

IT cooling enclosures for energy storage backup systems

Energy storage cell packaging and system with acceleration design

Distribution hardware for two phase system recirculation

Fluid connection apparatus for servers and racks

Cooling plate with coaxial fluid port

Sectional architecture for fluid management and leakage sensors

Chip to server packaging design for immersion systems

Data center multi-stage backup system

Connector alignment design for servers

Current detection based renewable energy system for a data center

Battery power management for a battery backup unit (BBU) shelf

High density server chassis packaging

Leak segregation and detection system for an electronics rack

Cooling distribution unit for electronic racks

Two phase immersion system with local fluid accelerations

Leak detection and prevention system

Patents Applicationslast 30 patents

INFORMATION TECHNOLOGY (IT) ENCLOSURE FOR BATTERY BACKUP SYSTEMS

SERVER AND COOLING SYSTEM FOR ENHANCED IMMERSION COOLING

SERVER RACK COOLING SYSTEM ARCHITECTURE

SIDE FLUID COOLING APPARATUS FOR SERVER RACKS

THERMAL MANAGEMENT DEVICE FOR HIGH DENSITY PROCESSING UNIT

CONTACTLESS DEVICE AND CHIP THERMAL MANAGEMENT PLATE

ACTIVE COOLING APPARATUS FOR BATTERY BACKUP UNITS

HIGH POWER DENSITY CHIPS BASED TWO-PHASE LOOP RECIRCULATION

HIGH COOLING EFFICIENCY DATA CENTER INCLUDING DIFFERENT SERVER CLUS...

HIGH-AVAILABILITY LIQUID COOLING SYSTEM FOR CHIP AND SERVER

DATA CENTER BATTERY CLUSTER WITH IMMERSION SYSTEM

SYSTEM ON A CHIP BASED COOLING SYSTEM

FLOW RATE SENSING SYSTEM FOR LIQUID COOLANT FLOW MANAGEMENT OF AN I...

SERVER MEMORY ARRAY COOLING HARDWARE

TWO-PHASE SYSTEM IN SERVER CLUSTER

DISTRIBUTION HARDWARE FOR TWO PHASE SYSTEM RECIRCULATION

SERVER PACKAGING FOR IMMERSION COOLING WITH LOCAL ACCELERATION

CHIP TO SERVER PACKAGING DESIGN FOR IMMERSION SYSTEMS

HIGH DENSITY SERVER CHASSIS PACKAGING

IT COOLING ENCLOSURES FOR ENERGY STORAGE BACKUP SYSTEMS

ENERGY STORAGE UNIT WITH INTEGRATED TWO-PHASE COOLING

FLUID CONNECTION APPARATUS FOR SERVERS AND RACKS

SERVER RACK USING A PASSIVE INTERNAL RETURN LOOP FOR TWO-PHASE FLUI...

ENERGY STORAGE CELL PACKAGING AND SYSTEM WITH ACCELERATION DESIGN

BATTERY PACK DESIGN FOR PHASE CHANGE MANAGEMENT

APPARATUS AND SYSTEM FOR HYBRID MULTI-PHASE SERVER COOLING

APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING WITH SERIAL CONDE...

COOLING SYSTEM FOR SINGLE PHASE IMMERSED SERVERS

APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING

DISTRIBUTION AND MANAGEMENT COOLING SYSTEM FOR IMMERSION LIQUID COO...