Tianyi LUO

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High I/O density flip-chip QFN
- Patent number 11,817,375
- Issue date Nov 14, 2023
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive plate stress reduction feature
- Patent number 11,658,130
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,024,564
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20250201774
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20230101847
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PLATE STRESS REDUCTION FEATURE
- Publication number 20220208692
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20210265246
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK
- Publication number 20200402894
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH I/O DENSITY FLIP-CHIP QFN
- Publication number 20200258822
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS
- Publication number 20200168533
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Packaged electronic device with film isolated power stack

Passives to facilitate mold compound flow

Multi-die package with multiple heat channels

Stress relief for flip-chip packaged devices

High I/O density flip-chip QFN

Conductive plate stress reduction feature

Packaged electronic device with film isolated power stack

Packaged electronic device with film isolated power stack

Patents Applicationslast 30 patents

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

Packaged Electronic Device With Film Isolated Power Stack

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

CONDUCTIVE PLATE STRESS REDUCTION FEATURE

Packaged Electronic Device With Film Isolated Power Stack

PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK

HIGH I/O DENSITY FLIP-CHIP QFN

MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS