Tiburcio A. Maldo

Person

Suzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Folded leadframe multiple die package
- Patent number 8,508,025
- Issue date Aug 13, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,426,953
- Issue date Apr 23, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded leadframe multiple die package
- Patent number 8,198,710
- Issue date Jun 12, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D smart power module
- Patent number 8,088,645
- Issue date Jan 3, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,030,743
- Issue date Oct 4, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages with multiple integrated substrates, sys...
- Patent number 7,952,204
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Yumin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiphase synchronous buck converter
- Patent number 7,902,646
- Issue date Mar 8, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase synchronous buck converter
- Patent number 7,821,114
- Issue date Oct 26, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D smart power module
- Patent number 7,808,101
- Issue date Oct 5, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase synchronous buck converter
- Patent number 7,696,612
- Issue date Apr 13, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless semiconductor package for efficient heat dissipation
- Patent number 7,586,179
- Issue date Sep 8, 2009
- Fairchild Semiconductor Corporation
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including stacked dice and heat sink stru...
- Patent number 7,564,124
- Issue date Jul 21, 2009
- Fairchild Semiconductor Corporation
- SangDo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FOLDED LEADFRAME MULTIPLE DIE PACKAGE
- Publication number 20120241930
- Publication date Sep 27, 2012
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20120001313
- Publication date Jan 5, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SMART POWER MODULE
- Publication number 20110070699
- Publication date Mar 24, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPHASE SYNCHRONOUS BUCK CONVERTER
- Publication number 20100167465
- Publication date Jul 1, 2010
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages With Multiple Integrated Substrates, Sys...
- Publication number 20090256252
- Publication date Oct 15, 2009
- Yumin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SMART POWER MODULE
- Publication number 20090200657
- Publication date Aug 13, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Compact Semiconductor Die Packages Suitable for Smart-Power Mo...
- Publication number 20090194857
- Publication date Aug 6, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED LEADFRAME MULTIPLE DIE PACKAGE
- Publication number 20090194855
- Publication date Aug 6, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPHASE SYNCHRONOUS BUCK CONVERTER
- Publication number 20090189262
- Publication date Jul 30, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPHASE SYNCHRONOUS BUCK CONVERTER
- Publication number 20090189273
- Publication date Jul 30, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20090174046
- Publication date Jul 9, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
- Publication number 20090091010
- Publication date Apr 9, 2009
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package including stacked dice and heat sink stru...
- Publication number 20080054417
- Publication date Mar 6, 2008
- SangDo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Tiburcio A. Maldo

Person

Patents Grantslast 30 patents

Folded leadframe multiple die package

Semiconductor package with an embedded printed circuit board and st...

Folded leadframe multiple die package

3D smart power module

Semiconductor package with an embedded printed circuit board and st...

Semiconductor die packages with multiple integrated substrates, sys...

Multiphase synchronous buck converter

Multiphase synchronous buck converter

3D smart power module

Multiphase synchronous buck converter

Wireless semiconductor package for efficient heat dissipation

Semiconductor die package including stacked dice and heat sink stru...

Patents Applicationslast 30 patents

FOLDED LEADFRAME MULTIPLE DIE PACKAGE

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...

3D SMART POWER MODULE

MULTIPHASE SYNCHRONOUS BUCK CONVERTER

Semiconductor Die Packages With Multiple Integrated Substrates, Sys...

3D SMART POWER MODULE

Thin Compact Semiconductor Die Packages Suitable for Smart-Power Mo...

FOLDED LEADFRAME MULTIPLE DIE PACKAGE

MULTIPHASE SYNCHRONOUS BUCK CONVERTER

MULTIPHASE SYNCHRONOUS BUCK CONVERTER

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...

WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION

Semiconductor die package including stacked dice and heat sink stru...