TREA

Tiburcio MALDO

Follow

Person

  • Consolacion, PH
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
    • Publication number 20240413148
    • Publication date Dec 12, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Tiburcio A. MALDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CLIP WITH ALIGNER STRUCTURE
    • Publication number 20240194631
    • Publication date Jun 13, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Keunhyuk LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CLIP
    • Publication number 20230326902
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Keunhyuk LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20220020740
    • Publication date Jan 20, 2022
    • Semiconductor Components Industries, LLC
    • Tiburcio A. MALDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR CLIP AND RELATED METHODS
    • Publication number 20210159157
    • Publication date May 27, 2021
    • Semiconductor Components Industries, LLC
    • Keunhyuk LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESS-FIT POWER MODULE AND RELATED METHODS
    • Publication number 20210021065
    • Publication date Jan 21, 2021
    • Semiconductor Components Industries, LLC
    • Jie CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS
    • Publication number 20200365493
    • Publication date Nov 19, 2020
    • Semiconductor Components Industries, LLC
    • Tiburcio MALDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20200258824
    • Publication date Aug 13, 2020
    • Semiconductor Components Industries, LLC
    • Tiburcio MALDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESS-FIT POWER MODULE AND RELATED METHODS
    • Publication number 20200144744
    • Publication date May 7, 2020
    • Semiconductor Components Industries, LLC
    • Jie CHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEADFRAME WITH SOCKETS FOR SOLDERLESS PINS
    • Publication number 20190304883
    • Publication date Oct 3, 2019
    • Semiconductor Components Industries, LLC
    • Tiburcio MALDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRESS-FIT POWER MODULE AND RELATED METHODS
    • Publication number 20190214749
    • Publication date Jul 11, 2019
    • Semiconductor Components Industries, LLC
    • Jie CHANG
    • H01 - BASIC ELECTRIC ELEMENTS