Tien-Chen HU

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing semiconductor wafer
- Patent number 9,852,932
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mao-Lin Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing station and method for processing semicond...
- Patent number 9,558,974
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Lin Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high vacuum (UHV) wafer processing
- Patent number 9,281,221
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-En Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization apparatus
- Patent number 8,057,280
- Issue date Nov 15, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
System for cleaning a wafer
- Patent number 7,823,241
- Issue date Nov 2, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization methods
- Patent number 7,824,243
- Issue date Nov 2, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Convex profile anode for electroplating system
- Patent number 7,014,739
- Issue date Mar 21, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tro-Hsu Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Calibration wafer and kit
- Patent number 6,914,337
- Issue date Jul 5, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Nan Chuang
- B24 - GRINDING POLISHING
Information Patent Grant
Linear chemical mechanical polishing apparatus equipped with progra...
- Patent number 6,837,774
- Issue date Jan 4, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Belt tensioning assembly for CMP apparatus
- Patent number 6,726,532
- Issue date Apr 27, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hun Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Ventilated platen/polishing pad assembly for chemcial mechanical po...
- Patent number 6,722,949
- Issue date Apr 20, 2004
- Taiwan Semiconductors Manufacturing Co., Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for removing coating layers from alignment mar...
- Patent number 6,649,077
- Issue date Nov 18, 2003
- Taiwan Semiconductor Manufacturing Co. Ltd
- Pang-Yen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cleaning the polishing pad of a linear pol...
- Patent number 6,561,880
- Issue date May 13, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Chih Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polish (CMP) planarizing method employing deriv...
- Patent number 6,524,959
- Issue date Feb 25, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fa Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Method for a copper CMP endpoint detection system
- Patent number 6,517,413
- Issue date Feb 11, 2003
- Taiwan Semiconductor Manufacturing Company
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer mounting plate for a polishing apparatus and method of using
- Patent number 6,315,649
- Issue date Nov 13, 2001
- Taiwan Semiconductor Manufacturing Company Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chemical mechanical polishing metal on a s...
- Patent number 6,227,947
- Issue date May 8, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for detecting leakage in a gas reactor
- Patent number 5,939,618
- Issue date Aug 17, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien J. Hu
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Apparatus for detecting leakage in a gas reactor
- Patent number 5,929,324
- Issue date Jul 27, 1999
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien Chen Hu
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFER
- Publication number 20170148651
- Publication date May 25, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Lin KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-HIGH VACUUM (UHV) WAFER PROCESSING
- Publication number 20140140792
- Publication date May 22, 2014
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-En Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING STATION AND METHOD FOR PROCESSING SEMICOND...
- Publication number 20140086720
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufaturing Company, Ltd.
- Mao-Lin KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS
- Publication number 20100323587
- Publication date Dec 23, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Tien-Chen HU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS
- Publication number 20080318494
- Publication date Dec 25, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Application
System for cleaning a wafer
- Publication number 20080229526
- Publication date Sep 25, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION WAFER AND KIT
- Publication number 20050091863
- Publication date May 5, 2005
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Chih-Nan Chuang
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for dry-loading of substrates in scrubber cleaner
- Publication number 20050069399
- Publication date Mar 31, 2005
- Chih-Ming Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Belt tensioning assembly for CMP apparatus
- Publication number 20040018808
- Publication date Jan 29, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung Lin
- B24 - GRINDING POLISHING
Information Patent Application
Convex profile anode for electroplating system
- Publication number 20030221958
- Publication date Dec 4, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tro-Hsu Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for removing coating layers from alignment mar...
- Publication number 20030116535
- Publication date Jun 26, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pang-Yen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear chemical mechanical polishing apparatus equipped with progra...
- Publication number 20020142704
- Publication date Oct 3, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Application
Ventilated platen/polishing pad assembly for chemical mechanical po...
- Publication number 20020137435
- Publication date Sep 26, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING

Tien-Chen HU

Person

Patents Grantslast 30 patents

Method for processing semiconductor wafer

Semiconductor processing station and method for processing semicond...

Ultra-high vacuum (UHV) wafer processing

Chemical mechanical planarization apparatus

System for cleaning a wafer

Chemical mechanical planarization methods

Convex profile anode for electroplating system

Calibration wafer and kit

Linear chemical mechanical polishing apparatus equipped with progra...

Belt tensioning assembly for CMP apparatus

Ventilated platen/polishing pad assembly for chemcial mechanical po...

Method and apparatus for removing coating layers from alignment mar...

Apparatus and method for cleaning the polishing pad of a linear pol...

Chemical mechanical polish (CMP) planarizing method employing deriv...

Method for a copper CMP endpoint detection system

Wafer mounting plate for a polishing apparatus and method of using

Apparatus and method for chemical mechanical polishing metal on a s...

Apparatus and method for detecting leakage in a gas reactor

Apparatus for detecting leakage in a gas reactor

Patents Applicationslast 30 patents

METHOD FOR PROCESSING SEMICONDUCTOR WAFER

ULTRA-HIGH VACUUM (UHV) WAFER PROCESSING

SEMICONDUCTOR PROCESSING STATION AND METHOD FOR PROCESSING SEMICOND...

CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS

CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS

System for cleaning a wafer

CALIBRATION WAFER AND KIT

Apparatus and method for dry-loading of substrates in scrubber cleaner

Belt tensioning assembly for CMP apparatus

Convex profile anode for electroplating system

Method and apparatus for removing coating layers from alignment mar...

Linear chemical mechanical polishing apparatus equipped with progra...

Ventilated platen/polishing pad assembly for chemical mechanical po...