Tien Heng Lem

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect structure with radial spokes for improved s...
- Patent number 11,355,429
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrical Interconnect Structure with Radial Spokes for Improved S...
- Publication number 20210233839
- Publication date Jul 29, 2021
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS