Tien Y. Wu

Follow

Person

The Morning Side, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making an encapsulated semiconductor chip module
- Patent number 6,558,981
- Issue date May 6, 2003
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated chip module and method of making same
- Patent number 6,246,124
- Issue date Jun 12, 2001
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for making an encapsulated semiconductor chip module
- Publication number 20010026959
- Publication date Oct 4, 2001
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS