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Tien-Yu Lee
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked silicon package assembly having thermal management
Patent number
11,355,412
Issue date
Jun 7, 2022
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joints for board level reliability
Patent number
10,930,611
Issue date
Feb 23, 2021
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
Patent number
10,529,645
Issue date
Jan 7, 2020
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Testing system for lid-less integrated circuit packages
Patent number
10,527,670
Issue date
Jan 7, 2020
Xilinx, Inc.
Gamal Refai-Ahmed
G01 - MEASURING TESTING
Information
Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
Patent number
10,319,606
Issue date
Jun 11, 2019
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for assembling and testing a multi-integrated...
Patent number
10,096,502
Issue date
Oct 9, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked silicon package assembly having an enhanced lid
Patent number
10,043,730
Issue date
Aug 7, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-use package substrate
Patent number
9,204,542
Issue date
Dec 1, 2015
Xilinx, Inc.
Tien-Yu Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System and method for large multiplexer identification and creation...
Patent number
8,739,087
Issue date
May 27, 2014
Atrenta, Inc.
Tien-Chien Lee
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
Publication number
20200105642
Publication date
Apr 2, 2020
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
Publication number
20180358280
Publication date
Dec 13, 2018
Xilinx, Inc.
Jaspreet Singh Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES
Publication number
20180284187
Publication date
Oct 4, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
G01 - MEASURING TESTING
Information
Patent Application
METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...
Publication number
20180144963
Publication date
May 24, 2018
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID
Publication number
20170092619
Publication date
Mar 30, 2017
Xilinx, Inc.
Gamal Refai-Ahmed
H01 - BASIC ELECTRIC ELEMENTS