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Tien-Yu T. Lee
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Scottsdale, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Redistributed chip packaging with thermal contact to device backside
Patent number
8,217,511
Issue date
Jul 10, 2012
FREESCALE SEMICONDUCTOR, INC.
Neil T. Tracht
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for a semiconductor device package with impro...
Patent number
7,892,882
Issue date
Feb 22, 2011
FREESCALE SEMICONDUCTOR, INC.
George R. Leal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including a conductive stud over a bonding pad re...
Patent number
7,812,448
Issue date
Oct 12, 2010
FREESCALE SEMICONDUCTOR, INC.
Lakshmi N. Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for thermal management in a multi-layer embed...
Patent number
7,405,102
Issue date
Jul 29, 2008
FREESCALE SEMICONDUCTOR, INC.
Tien Yu T. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure and method of thermally protecting power devices for airb...
Patent number
6,906,900
Issue date
Jun 14, 2005
FREESCALE SEMICONDUCTOR, INC.
Paul T. Bennett
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Electronic component and method of manufacturing same
Patent number
6,897,562
Issue date
May 24, 2005
Motorola Corporation
Lei L. Mercado
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System and method for cooling using an oscillatory impinging jet
Patent number
6,418,016
Issue date
Jul 9, 2002
Motorola, Inc.
Victor A. Chiriac
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
System and method to control solder reflow furnace with wafer surfa...
Patent number
6,352,192
Issue date
Mar 5, 2002
Motorola, Inc.
Tien-Yu Tom Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor component having a semiconductor chip mounted to a ch...
Patent number
6,081,037
Issue date
Jun 27, 2000
Motorola, Inc.
Tien-Yu Tom Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method
Patent number
6,040,624
Issue date
Mar 21, 2000
Motorola, Inc.
Benjamin C. Chambers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation apparatus and method
Patent number
5,915,463
Issue date
Jun 29, 1999
Motorola, Inc.
Guillermo L. Romero
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor crystal growth method
Patent number
5,487,355
Issue date
Jan 30, 1996
Motorola, Inc.
Herng-Der Chiou
C30 - CRYSTAL GROWTH
Information
Patent Grant
Adjustable plating cell for uniform bump plating of semiconductor w...
Patent number
5,391,285
Issue date
Feb 21, 1995
Motorola, Inc.
William H. Lytle
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Simulation of two-phase liquid cooling for thermal prediction of di...
Patent number
5,050,114
Issue date
Sep 17, 1991
Motorola, Inc.
Tien-Yu T. Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
Publication number
20120252169
Publication date
Oct 4, 2012
FREESCALE SEMICONDUCTOR, INC.
Neil T. Tracht
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STUD...
Publication number
20110027984
Publication date
Feb 3, 2011
FREESCALE SEMICONDUCTOR, INC.
Lakshmi N. Ramanathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
Publication number
20090032933
Publication date
Feb 5, 2009
Neil T. Tracht
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatus for a semiconductor device package with impro...
Publication number
20070284704
Publication date
Dec 13, 2007
George R. Leal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatus for thermal management in a multi-layer embed...
Publication number
20070284711
Publication date
Dec 13, 2007
Tien Yu T. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated cooling design with heat pipes
Publication number
20070056713
Publication date
Mar 15, 2007
Victor A. Chiriac
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component and method of manufacturing same
Publication number
20040201106
Publication date
Oct 14, 2004
MOTOROLA, INC.
Lei L. Mercado
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SYSTEM AND METHOD FOR COOLING USING AN OSCILLATORY IMPINGING JET
Publication number
20020093791
Publication date
Jul 18, 2002
MOTOROLA, INC.
Victor A. Chiriac
G06 - COMPUTING CALCULATING COUNTING