Tiffany Zink

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Sheridan, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
VIA PROFILE SHRINK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRIC...
- Publication number 20230178426
- Publication date Jun 8, 2023
- Intel Corporation
- Tiffany ZINK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTE...
- Publication number 20230102711
- Publication date Mar 30, 2023
- Intel Corporation
- Ming-Yi Shen
- H01 - BASIC ELECTRIC ELEMENTS