Tighe A. Spurlin

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Removal of electroplating bath additives
- Patent number 11,280,022
- Issue date Mar 22, 2022
- Lam Research Corporation
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 10,745,817
- Issue date Aug 18, 2020
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removal of electroplating bath additives
- Patent number 10,711,366
- Issue date Jul 14, 2020
- Lam Research Corporation
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for remote plasma treatment for reducing metal...
- Patent number 9,865,501
- Issue date Jan 9, 2018
- Lam Research Corporation
- Tighe A. Spurlin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Configuration and method of operation of an electrodeposition syste...
- Patent number 9,816,193
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for characterizing metal oxide reduction
- Patent number 9,472,377
- Issue date Oct 18, 2016
- Lam Research Corporation
- Edward C. Opocensky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Current ramping and current pulsing entry of substrates for electro...
- Patent number 9,385,035
- Issue date Jul 5, 2016
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for reducing metal oxide surfaces to modified metal surface...
- Patent number 9,070,750
- Issue date Jun 30, 2015
- Novellus Systems, Inc.
- Tighe A. Spurlin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF
- Publication number 20230178430
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVELING COMPOUND CONTROL
- Publication number 20230144437
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- Matthew A. Rigsby
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS
- Publication number 20220102209
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVAL OF ELECTROPLATING BATH ADDITIVES
- Publication number 20200308724
- Publication date Oct 1, 2020
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVAL OF ELECTROPLATING BATH ADDITIVES
- Publication number 20190203375
- Publication date Jul 4, 2019
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20180350670
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20180038007
- Publication date Feb 8, 2018
- Novellus Systems, Inc.
- Kousik Ganesan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION
- Publication number 20160111342
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Ludan Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION
- Publication number 20160111344
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Edward C. Opocensky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING
- Publication number 20150376792
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...
- Publication number 20150299886
- Publication date Oct 22, 2015
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20150072538
- Publication date Mar 12, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACE...
- Publication number 20140256127
- Publication date Sep 11, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20140256128
- Publication date Sep 11, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTRO...
- Publication number 20140224661
- Publication date Aug 14, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES
- Publication number 20140199497
- Publication date Jul 17, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Selective Capping of Metal Interconnect Lines during Air Gap Formation
- Publication number 20130323930
- Publication date Dec 5, 2013
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20130284604
- Publication date Oct 31, 2013
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...
- Publication number 20120175263
- Publication date Jul 12, 2012
- Kousik GANESAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tighe A. Spurlin

Person

Patents Grantslast 30 patents

Removal of electroplating bath additives

Monitoring surface oxide on seed layers during electroplating

Configuration and method of operation of an electrodeposition syste...

Removal of electroplating bath additives

Monitoring surface oxide on seed layers during electroplating

Method and apparatus for remote plasma treatment for reducing metal...

Configuration and method of operation of an electrodeposition syste...

Method and apparatus for electroplating semiconductor wafer when co...

Method and apparatus for characterizing metal oxide reduction

Current ramping and current pulsing entry of substrates for electro...

Methods for reducing metal oxide surfaces to modified metal surface...

Patents Applicationslast 30 patents

ELECTROPLATING COBALT, NICKEL, AND ALLOYS THEREOF

LEVELING COMPOUND CONTROL

ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS

REMOVAL OF ELECTROPLATING BATH ADDITIVES

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

REMOVAL OF ELECTROPLATING BATH ADDITIVES

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION

METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION

ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING

METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACE...

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTRO...

METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES

Selective Capping of Metal Interconnect Lines during Air Gap Formation

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTE...