Tim BOETTCHER

Person

Lauenbrueck, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement
- Patent number 10,056,459
- Issue date Aug 21, 2018
- Nexperia B.V.
- Thomas Igel-Holtzendorff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive device and associated method of manufacture
- Patent number 9,911,816
- Issue date Mar 6, 2018
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,735,290
- Issue date Aug 15, 2017
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode having a reduced surface field effect trench structure and me...
- Patent number 9,461,183
- Issue date Oct 4, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device and manufacturing method
- Patent number 9,349,819
- Issue date May 24, 2016
- NXP B.V.
- Godefridus Adrianus Maria Hurkx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 9,263,335
- Issue date Feb 16, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device with conductive barrier portion...
- Patent number 9,064,847
- Issue date Jun 23, 2015
- NXP B.V.
- Godefridus Andrianus Maria Hurkx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 8,981,566
- Issue date Mar 17, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190189545
- Publication date Jun 20, 2019
- NEXPERIA B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE
- Publication number 20180174951
- Publication date Jun 21, 2018
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160225918
- Publication date Aug 4, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT
- Publication number 20160172451
- Publication date Jun 16, 2016
- NXP B.V.
- Thomas Igel-Holtzendorff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20160020296
- Publication date Jan 21, 2016
- NXP B.V.
- Godefridus Adrianus Maria HURKX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTIVE DEVICE AND ASSOCIATED METHOD OF MANUFACTURE
- Publication number 20150333133
- Publication date Nov 19, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE
- Publication number 20150287666
- Publication date Oct 8, 2015
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20150140739
- Publication date May 21, 2015
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20150091023
- Publication date Apr 2, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20130320551
- Publication date Dec 5, 2013
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20130320400
- Publication date Dec 5, 2013
- NXP B.V.
- Godefridus Adrianus Maria HURKX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
- Publication number 20120286399
- Publication date Nov 15, 2012
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS

Tim BOETTCHER

Person

Patents Grantslast 30 patents

Semiconductor device and method with clip arrangement in IC package

Electronic device

Semiconductor arrangement

Semiconductive device and associated method of manufacture

Semiconductor device

Diode having a reduced surface field effect trench structure and me...

Lead for connection to a semiconductor device

Heterojunction semiconductor device and manufacturing method

Discrete semiconductor device package and manufacturing method

Heterojunction semiconductor device with conductive barrier portion...

Discrete semiconductor device package and manufacturing method

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT

HETEROJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTIVE DEVICE AND ASSOCIATED METHOD OF MANUFACTURE

LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

Semiconductor Device and Method of Manufacturing

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

HETEROJUNCTION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE