Tim Olson

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 12,334,396
- Issue date Jun 17, 2025
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded structure with multi-height components comprising back...
- Patent number 12,300,561
- Issue date May 13, 2025
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
- Patent number 12,261,140
- Issue date Mar 25, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly comprising a 3D block and method of making t...
- Patent number 12,205,881
- Issue date Jan 21, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 12,170,261
- Issue date Dec 17, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect substrate and methods of making...
- Patent number 12,062,550
- Issue date Aug 13, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 12,057,373
- Issue date Aug 6, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for redistribution layer (RDL) repair by mitigating at least...
- Patent number 11,887,862
- Issue date Jan 30, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 11,791,207
- Issue date Oct 17, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
- Patent number 11,749,534
- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with through silicon via (TSV)...
- Patent number 11,728,248
- Issue date Aug 15, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step high aspect ratio vertical interconnect and method of ma...
- Patent number 11,664,321
- Issue date May 30, 2023
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with through silicon...
- Patent number 11,616,003
- Issue date Mar 28, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded bridge interposer and method of making the same
- Patent number 11,538,759
- Issue date Dec 27, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor structure with face mounted passives and...
- Patent number 11,444,051
- Issue date Sep 13, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
- Patent number 11,056,453
- Issue date Jul 6, 2021
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded semiconductor package for power devices and method of...
- Patent number 10,818,635
- Issue date Oct 27, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging
- Patent number 10,373,870
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 10,056,304
- Issue date Aug 21, 2018
- Deca Technologies Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
- Patent number 9,887,103
- Issue date Feb 6, 2018
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 9,831,170
- Issue date Nov 28, 2017
- Deca Technologies, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shielding for wafer plating
- Patent number 9,653,339
- Issue date May 16, 2017
- Deca Technologies Inc.
- Tim Olson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 9,640,495
- Issue date May 2, 2017
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive patterning for panelized packaging
- Patent number 9,520,331
- Issue date Dec 13, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adaptive patterning for panelized packaging
- Patent number 9,418,905
- Issue date Aug 16, 2016
- Deca Technologies Inc.
- Timothy L. Olson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 9,401,313
- Issue date Jul 26, 2016
- Deca Technologies, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of land grid array packaging with b...
- Patent number 9,269,622
- Issue date Feb 23, 2016
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20250174542
- Publication date May 29, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT...
- Publication number 20250167003
- Publication date May 22, 2025
- Deca Technologies USA, Inc.
- Craig BISHOP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...
- Publication number 20250112141
- Publication date Apr 3, 2025
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDI...
- Publication number 20240429201
- Publication date Dec 26, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...
- Publication number 20240404840
- Publication date Dec 5, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...
- Publication number 20240395673
- Publication date Nov 28, 2024
- Deca Technologies USA, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...
- Publication number 20240243089
- Publication date Jul 18, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20240222193
- Publication date Jul 4, 2024
- David Ryan BARTLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20240213135
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR BY MITIGATING AT LEAST...
- Publication number 20240170300
- Publication date May 23, 2024
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...
- Publication number 20240030113
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...
- Publication number 20240030174
- Publication date Jan 25, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230411333
- Publication date Dec 21, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...
- Publication number 20230387060
- Publication date Nov 30, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...
- Publication number 20230386860
- Publication date Nov 30, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230378029
- Publication date Nov 23, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230238304
- Publication date Jul 27, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20230142384
- Publication date May 11, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR
- Publication number 20230085067
- Publication date Mar 16, 2023
- Deca Technologies USA, Inc.
- Craig Bishop
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20230047504
- Publication date Feb 16, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...
- Publication number 20230005819
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...
- Publication number 20230005820
- Publication date Jan 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220352106
- Publication date Nov 3, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...
- Publication number 20220246532
- Publication date Aug 4, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20220238445
- Publication date Jul 28, 2022
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...
- Publication number 20220173067
- Publication date Jun 2, 2022
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Unit specific variable or adaptive metal fill and system and method...

Fully molded structure with multi-height components comprising back...

Stackable fully molded semiconductor structure with vertical interc...

Semiconductor assembly comprising a 3D block and method of making t...

Molded direct contact interconnect structure without capture pads a...

Molded direct contact interconnect substrate and methods of making...

Stackable fully molded semiconductor structure with through silicon...

Molded direct contact interconnect structure without capture pads a...

Method for redistribution layer (RDL) repair by mitigating at least...

Unit specific variable or adaptive metal fill and system and method...

Quad flat no-lead (QFN) package without leadframe and direct contac...

Fully molded semiconductor structure with through silicon via (TSV)...

Multi-step high aspect ratio vertical interconnect and method of ma...

Stackable fully molded semiconductor structure with through silicon...

Fully molded bridge interposer and method of making the same

Fully molded semiconductor structure with face mounted passives and...

Stackable fully molded semiconductor structure with vertical interc...

Fully molded semiconductor package for power devices and method of...

Semiconductor device processing method for material removal

Semiconductor device and method of packaging

Fully molded miniaturized semiconductor module

Automated optical inspection of unit specific patterning

Semiconductor device and method of adaptive patterning for panelize...

Fully molded miniaturized semiconductor module

Integrated shielding for wafer plating

Semiconductor device processing method for material removal

Adaptive patterning for panelized packaging

Adaptive patterning for panelized packaging

Automated optical inspection of unit specific patterning

Semiconductor device and method of land grid array packaging with b...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT...

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND WITH LAYER OF...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDI...

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...

LAYERED MOLDED DIRECT CONTACT AND DIELECTRIC STRUCTURE AND METHOD F...

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR BY MITIGATING AT LEAST...

QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTAC...

QUAD FLAT NO-LEAD (QFN) PACKAGE WITH BACKSIDE CONDUCTIVE MATERIAL A...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS A...

MOLDED DIRECT CONTACT INTERCONNECT SUBSTRATE AND METHODS OF MAKING...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

SYSTEM AND METHOD FOR REDISTRIBUTION LAYER (RDL) REPAIR

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV)...

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...

MULTI-STEP HIGH ASPECT RATIO VERTICAL INTERCONNECT AND METHOD OF MA...

FULLY MOLDED BRIDGE INTERPOSER AND METHOD OF MAKING THE SAME

FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH FACE MOUNTED PASSIVES AND...