Tim S. Wihl

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Coordinate fusion and thickness calibration for semiconductor wafer...
- Patent number 8,629,902
- Issue date Jan 14, 2014
- KLA-Tencor Corporation
- Isabella T. Lewis
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for multi-dimensional metrology and/or inspecti...
- Patent number 7,126,699
- Issue date Oct 24, 2006
- KLA-Tencor Technologies Corp.
- Tim Wihl
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for multi-dimensional inspection and/or metrolo...
- Patent number 6,917,421
- Issue date Jul 12, 2005
- KLA-Tencor Technologies Corp.
- Tim Wihl
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COORDINATE FUSION AND THICKNESS CALIBRATION FOR SEMICONDUCTOR WAFER...
- Publication number 20120086796
- Publication date Apr 12, 2012
- KLA-Tencor Corporation
- Isabella T. Lewis
- G06 - COMPUTING CALCULATING COUNTING