Timo Bohnenberger

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Neutraubling, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with barrier to contain thermal interface mat...
- Patent number 11,626,351
- Issue date Apr 11, 2023
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369166
- Publication date Nov 16, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Barrier to Contain Thermal Interface Mat...
- Publication number 20220238422
- Publication date Jul 28, 2022
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS