Timothe Litt

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Southborough, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic package substrate with recessed device
- Patent number 8,264,846
- Issue date Sep 11, 2012
- Intel Corporation
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Individual sub-assembly containing a ceramic interposer, silicon vo...
- Patent number 7,675,160
- Issue date Mar 9, 2010
- Intel Corporation
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Individual sub-assembly containing a ceramic interposer, silicon vo...
- Publication number 20080157274
- Publication date Jul 3, 2008
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic interposer with silicon voltage regulator and array capacit...
- Publication number 20080157343
- Publication date Jul 3, 2008
- Sriram Dattaguru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC PACKAGE SUBSTRATE WITH RECESSED DEVICE
- Publication number 20080142961
- Publication date Jun 19, 2008
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR