Timothy A. GOSSELIN

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless package architecture for multi-chip opto-electronics
- Patent number 10,845,552
- Issue date Nov 24, 2020
- Intel Corporation
- Shawna M. Liff
- G02 - OPTICS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ablation method and recipe for wafer level underfill material patte...
- Patent number 9,786,517
- Issue date Oct 10, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20250118698
- Publication date Apr 10, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE
- Publication number 20240395567
- Publication date Nov 28, 2024
- Intel Corporation
- Jonas G. Croissant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230088170
- Publication date Mar 23, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
- Publication number 20230086691
- Publication date Mar 23, 2023
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS...
- Publication number 20230078395
- Publication date Mar 16, 2023
- Intel Corporation
- Robin Mcree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC REDISTRIBUTION LAYER ON ORGANIC SUBSTRATE IN INTEGRATED C...
- Publication number 20220375844
- Publication date Nov 24, 2022
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL ELECTRICALLY INACTIVE DEVICES FOR INTEGRATED CIRCUIT PACK...
- Publication number 20220165625
- Publication date May 26, 2022
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGE ARCHITECTURE FOR MULTI-CHIP OPTO-ELECTRONICS
- Publication number 20190317285
- Publication date Oct 17, 2019
- Intel Corporation
- Shawna M. LIFF
- G02 - OPTICS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE
- Publication number 20180358296
- Publication date Dec 13, 2018
- Intel Corporation
- Eric J. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20180337129
- Publication date Nov 22, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...
- Publication number 20150072479
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Timothy A. GOSSELIN

Person

Patents Grantslast 30 patents

Electronic assembly that includes a bridge

Microelectronic structures having multiple microelectronic devices...

Coreless package architecture for multi-chip opto-electronics

Microelectronic structures having multiple microelectronic devices...

Microelectronic structures having multiple microelectronic devices...

Ablation method and recipe for wafer level underfill material patte...

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES

DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS...

INORGANIC REDISTRIBUTION LAYER ON ORGANIC SUBSTRATE IN INTEGRATED C...

UNIVERSAL ELECTRICALLY INACTIVE DEVICES FOR INTEGRATED CIRCUIT PACK...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

CORELESS PACKAGE ARCHITECTURE FOR MULTI-CHIP OPTO-ELECTRONICS

ELECTRONIC ASSEMBLY THAT INCLUDES A BRIDGE

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

ADAPTIVE TCB BY DATA FEED FORWARD

ABLATION METHOD AND RECIPE FOR WAFER LEVEL UNDERFILL MATERIAL PATTE...