Timothy Antesberger

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Extrusion dies and methods of manufacturing the same
- Patent number 12,122,066
- Issue date Oct 22, 2024
- Corning Incorporated
- Timothy Eugene Antesberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing an electrode for use in forming a honeycomb ext...
- Patent number 11,833,604
- Issue date Dec 5, 2023
- Corning Incorporated
- Timothy Eugene Antesberger
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for skinning articles
- Patent number 10,611,051
- Issue date Apr 7, 2020
- Corning Incorporated
- Brian Michael Adams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Coreless layer buildup structure with LGA and joining layer
- Patent number 9,351,408
- Issue date May 24, 2016
- i3 ELECTRONICS, INC.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless layer buildup structure
- Patent number 8,541,687
- Issue date Sep 24, 2013
- Endicott Interconnect Technologies, Inc.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless layer buildup structure with LGA
- Patent number 8,536,459
- Issue date Sep 17, 2013
- Endicott Interconnect Technologies, Inc.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package including high density interposer and circuitize...
- Patent number 8,405,229
- Issue date Mar 26, 2013
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making high density interposer and electronic package uti...
- Patent number 8,245,392
- Issue date Aug 21, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power core for use in circuitized substrate and method of making same
- Patent number 8,198,551
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,163,847
- Issue date Jan 16, 2007
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,091,066
- Issue date Aug 15, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,084,014
- Issue date Aug 1, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material separation to form segmented product
- Patent number 6,958,106
- Issue date Oct 25, 2005
- Endicott International Technologies, Inc.
- Timothy E. Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING AN ELECTRODE FOR USE IN FORMING A HONEYCOMB EXT...
- Publication number 20220234108
- Publication date Jul 28, 2022
- Corning Incorporated
- Timothy Eugene Antesberger
- B22 - CASTING POWDER METALLURGY
Information Patent Application
EXTRUSION DIES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220105658
- Publication date Apr 7, 2022
- Corning Incorporated
- Timothy Eugene Antesberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR MANUFACTURING OF HONEYCOMB EXTRUSION DIES AND MANUFACTUR...
- Publication number 20220048234
- Publication date Feb 17, 2022
- Corning Incorporated
- Timothy Eugene Antesberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SKINNING ARTICLES
- Publication number 20170239840
- Publication date Aug 24, 2017
- Corning Incorporated
- Brian Michael Adams
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THERMAL SUBSTRATE
- Publication number 20130025839
- Publication date Jan 31, 2013
- Endicott Interconnect Technologies, Inc.
- Frank Egitto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE
- Publication number 20120160547
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE WITH LGA
- Publication number 20120160544
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER
- Publication number 20120031649
- Publication date Feb 9, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20110284273
- Publication date Nov 24, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making high density interposer and electronic package uti...
- Publication number 20110126408
- Publication date Jun 2, 2011
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package including high density interposer and circuitize...
- Publication number 20110127664
- Publication date Jun 2, 2011
- Timothy Antesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060046462
- Publication date Mar 2, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060040426
- Publication date Feb 23, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material separation to form segmented product
- Publication number 20050224167
- Publication date Oct 13, 2005
- Endicott Interconnect Technologies, Inc.
- Timothy E. Antesberger
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20050074924
- Publication date Apr 7, 2005
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Material separation to form segmented product
- Publication number 20040201136
- Publication date Oct 14, 2004
- Endicott Interconnect Technologies, Inc.
- Timothy E. Antesberger
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD

Timothy Antesberger

Person

Patents Grantslast 30 patents

Extrusion dies and methods of manufacturing the same

Method of preparing an electrode for use in forming a honeycomb ext...

Systems and methods for skinning articles

Coreless layer buildup structure with LGA and joining layer

Coreless layer buildup structure

Coreless layer buildup structure with LGA

Electronic package including high density interposer and circuitize...

Method of making high density interposer and electronic package uti...

Power core for use in circuitized substrate and method of making same

Method of making circuitized substrate

Method of making circuitized substrate

Method of making circuitized substrate

Material separation to form segmented product

Patents Applicationslast 30 patents

METHOD OF PREPARING AN ELECTRODE FOR USE IN FORMING A HONEYCOMB EXT...

EXTRUSION DIES AND METHODS OF MANUFACTURING THE SAME

SYSTEM FOR MANUFACTURING OF HONEYCOMB EXTRUSION DIES AND MANUFACTUR...

SYSTEMS AND METHODS FOR SKINNING ARTICLES

THERMAL SUBSTRATE

CORELESS LAYER BUILDUP STRUCTURE

CORELESS LAYER BUILDUP STRUCTURE WITH LGA

CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER

POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME

Method of making high density interposer and electronic package uti...

Electronic package including high density interposer and circuitize...

Circuitized substrate, method of making same and information handli...

Circuitized substrate, method of making same and information handli...

Material separation to form segmented product

Circuitized substrate, method of making same and information handli...

Material separation to form segmented product