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Timothy B. Dean
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Elk Grove, IL, US
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Patents Grants
last 30 patents
Information
Patent Grant
Process to reform a plastic packaged integrated circuit die
Patent number
7,434,310
Issue date
Oct 14, 2008
Motorola, Inc.
Timothy B. Dean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overmolded electronic assembly and overmoldable interface component
Patent number
7,390,978
Issue date
Jun 24, 2008
Motorola, Inc.
Timothy B. Dean
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Peelable circuit board foil
Patent number
7,241,510
Issue date
Jul 10, 2007
Motorola, Inc.
Gregory J. Dunn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit dielectric foil and embedded capacitors
Patent number
7,193,838
Issue date
Mar 20, 2007
Motorola, Inc.
Gregory J. Dunn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Corrosion-resistant copper bond pad and integrated device
Patent number
7,078,796
Issue date
Jul 18, 2006
FREESCALE SEMICONDUCTOR, INC.
Gregory J. Dunn
G01 - MEASURING TESTING
Information
Patent Grant
Activation plate for electroless and immersion plating of integrate...
Patent number
6,974,776
Issue date
Dec 13, 2005
FREESCALE SEMICONDUCTOR, INC.
Timothy B. Dean
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Peelable circuit board foil
Patent number
6,872,468
Issue date
Mar 29, 2005
Motorola, Inc.
Timothy B. Dean
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PROCESS FOR REFORMING A PLASTIC PACKAGED INTEGRATED CIRCUIT DIE AND...
Publication number
20070278676
Publication date
Dec 6, 2007
MOTOROLA, INC.
Timothy B. Dean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Peelable circuit board foil
Publication number
20060269728
Publication date
Nov 30, 2006
Gregory J. Dunn
B32 - LAYERED PRODUCTS
Information
Patent Application
Overmolded electronic assembly and overmoldable interface component
Publication number
20060141828
Publication date
Jun 29, 2006
Timothy B. Dean
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit dielectric foil and embedded capacitors
Publication number
20050135074
Publication date
Jun 23, 2005
Gregory J. Dunn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Corrosion-resistant bond pad and integrated device
Publication number
20050104207
Publication date
May 19, 2005
Timothy B. Dean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PEELABLE CIRCUIT BOARD FOIL
Publication number
20050079375
Publication date
Apr 14, 2005
Timothy B. Dean
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Activation plate for electroless and immersion plating of integrate...
Publication number
20050003677
Publication date
Jan 6, 2005
MOTOROLA, INC.
Timothy B. Dean
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Corrosion-resistant bond pad and integrated device
Publication number
20050001316
Publication date
Jan 6, 2005
MOTOROLA, INC.
Timothy B. Dean
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Corrosion-resistant copper bond pad and integrated device
Publication number
20050001324
Publication date
Jan 6, 2005
MOTOROLA, INC.
Gregory J. Dunn
G01 - MEASURING TESTING