Timothy Brooks Bambridge

Person

Pittstown, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,637,414
- Issue date Dec 29, 2009
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,541,220
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,443,042
- Issue date Oct 28, 2008
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for electronic modules
- Patent number 7,433,192
- Issue date Oct 7, 2008
- Agere Systems Inc.
- Timothy B. Bambridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe designs for integrated circuit plastic packages
- Patent number 7,221,042
- Issue date May 22, 2007
- Agere Systems Inc.
- Timothy B. Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent high-power amplifier module
- Patent number 7,215,204
- Issue date May 8, 2007
- Agere Systems Inc.
- Timothy B. Bambridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for wire bonding with wire length adjustment...
- Patent number 7,086,148
- Issue date Aug 8, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,030,472
- Issue date Apr 18, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Apparatus for Wire Bonding with Wire Length Adjustment...
- Publication number 20080283578
- Publication date Nov 20, 2008
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for wire bonding with wire length adjustment...
- Publication number 20060158856
- Publication date Jul 20, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intelligent high-power amplifier module
- Publication number 20060139089
- Publication date Jun 29, 2006
- Timothy B. Bambridge
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Packaging for electronic modules
- Publication number 20060139896
- Publication date Jun 29, 2006
- Timothy B. Bambridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadframe designs for integrated circuit plastic packages
- Publication number 20060108670
- Publication date May 25, 2006
- Timothy B. Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having flexible leadframe
- Publication number 20060097367
- Publication date May 11, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having flexible leadframe
- Publication number 20050224926
- Publication date Oct 13, 2005
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for wire bonding with wire length adjustment...
- Publication number 20050183265
- Publication date Aug 25, 2005
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS

Timothy Brooks Bambridge

Person

Patents Grantslast 30 patents

Methods and apparatus for wire bonding with wire length adjustment...

Integrated circuit device having flexible leadframe

Methods and apparatus for wire bonding with wire length adjustment...

Packaging for electronic modules

Leadframe designs for integrated circuit plastic packages

Intelligent high-power amplifier module

Methods and apparatus for wire bonding with wire length adjustment...

Integrated circuit device having flexible leadframe

Patents Applicationslast 30 patents

Methods and Apparatus for Wire Bonding with Wire Length Adjustment...

Methods and apparatus for wire bonding with wire length adjustment...

Intelligent high-power amplifier module

Packaging for electronic modules

Leadframe designs for integrated circuit plastic packages

Integrated circuit device having flexible leadframe

Integrated circuit device having flexible leadframe

Methods and apparatus for wire bonding with wire length adjustment...