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Timothy C. Krywanczyk
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Essex Junction, VT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Silicon chicklet pedestal
Patent number
8,806,740
Issue date
Aug 19, 2014
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Grant
Silicon chicklet pedestal
Patent number
8,595,919
Issue date
Dec 3, 2013
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
Patent number
8,163,602
Issue date
Apr 24, 2012
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to recover patterned semiconductor wafers for rework
Patent number
8,034,718
Issue date
Oct 11, 2011
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming silicon chicklet pedestal
Patent number
7,987,591
Issue date
Aug 2, 2011
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Grant
Method of thinning a semiconductor substrate
Patent number
7,932,614
Issue date
Apr 26, 2011
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
Patent number
7,902,682
Issue date
Mar 8, 2011
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of thinning a semiconductor substrate
Patent number
7,867,876
Issue date
Jan 11, 2011
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosion inhibitor additives to prevent semiconductor device bond-...
Patent number
7,855,130
Issue date
Dec 21, 2010
International Business Machines Corporation
Robert R Cadieux
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Inspection method for protecting image sensor devices with front su...
Patent number
7,844,099
Issue date
Nov 30, 2010
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods to prevent ECC (edge chipping and cracking) damage during d...
Patent number
7,771,560
Issue date
Aug 10, 2010
International Business Machines Corporation
James R. Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for recycling of ion implantation monitor wafers
Patent number
7,732,303
Issue date
Jun 8, 2010
International Business Machines Corporation
Steven Ross Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and device for thinning wafers that have contact bumps
Patent number
7,722,446
Issue date
May 25, 2010
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recycling of ion implantation monitor wafers
Patent number
7,700,488
Issue date
Apr 20, 2010
International Business Machines Corporation
Steven Ross Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to remove circuit patterns from a wafer
Patent number
7,666,689
Issue date
Feb 23, 2010
International Business Machines Corporation
Steven R. Codding
B24 - GRINDING POLISHING
Information
Patent Grant
Tape removal in semiconductor structure fabrication
Patent number
7,572,739
Issue date
Aug 11, 2009
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon wafer thinning end point method
Patent number
7,498,236
Issue date
Mar 3, 2009
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Application of a thermally conductive thin film to a wafer backside...
Patent number
7,387,911
Issue date
Jun 17, 2008
International Business Machines Corporation
David M Audette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rework process for removing residual UV adhesive from C4 wafer surf...
Patent number
7,348,216
Issue date
Mar 25, 2008
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer front side protection
Patent number
7,288,465
Issue date
Oct 30, 2007
International Business Machines Corpoartion
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for thinning wafers that have contact bumps
Patent number
7,135,124
Issue date
Nov 14, 2006
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of photoresist in substrate vias during backside grind
Patent number
7,074,715
Issue date
Jul 11, 2006
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of polishing C4 molybdenum masks to remove molybdenum peaks
Patent number
7,025,891
Issue date
Apr 11, 2006
International Business Machines Corporation
Steven R. Codding
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor wafer front side protection
Patent number
7,001,827
Issue date
Feb 21, 2006
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of photoresist in substrate vias during backside grind
Patent number
6,888,223
Issue date
May 3, 2005
International Business Machines Corporation
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to prevent leaving residual metal in CMP process of metal in...
Patent number
6,599,173
Issue date
Jul 29, 2003
International Business Machines Corporation
Jose L. Cruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of slurry build-up within wafer topography during polishing
Patent number
6,455,434
Issue date
Sep 24, 2002
International Business Machines Corporation
Chad R. Binkerd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical-mechanical-polishing slurry and method for polishing metal...
Patent number
6,355,565
Issue date
Mar 12, 2002
International Business Machines Corporation
Paul M. Feeney
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for reworking copper metallurgy in semiconductor devices
Patent number
6,340,601
Issue date
Jan 22, 2002
International Business Machines Corporation
Thomas F. Curran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling stress in a film
Patent number
6,328,794
Issue date
Dec 11, 2001
International Business Machines Corporation
Donald Walter Brouillette
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
SILICON CHICKLET PEDESTAL
Publication number
20110199108
Publication date
Aug 18, 2011
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Application
SILICON CHICKLET PEDESTAL
Publication number
20110199109
Publication date
Aug 18, 2011
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Application
ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTO...
Publication number
20110115072
Publication date
May 19, 2011
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CHICKLET PEDESTAL
Publication number
20110037489
Publication date
Feb 17, 2011
International Business Machines Corporation
S. Jay Chey
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE
Publication number
20110031620
Publication date
Feb 10, 2011
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE
Publication number
20100155936
Publication date
Jun 24, 2010
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR RECYCLING OF ION IMPLANTATION MONITOR WAFERS
Publication number
20090197400
Publication date
Aug 6, 2009
Steven Ross Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING D...
Publication number
20090084499
Publication date
Apr 2, 2009
International Business Machines Corporation
James R. Johnson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECYCLING OF ION IMPLANTATION MONITOR WAFERS
Publication number
20080171439
Publication date
Jul 17, 2008
Steven Ross Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO RECOVER PATTERNED SEMICONDUCTOR WAFERS FOR REWORK
Publication number
20080138989
Publication date
Jun 12, 2008
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to Remove Circuit Patterns from a Wafer
Publication number
20080139088
Publication date
Jun 12, 2008
Steven R. Codding
B24 - GRINDING POLISHING
Information
Patent Application
SILICON WAFER THINNING END POINT METHOD
Publication number
20080124896
Publication date
May 29, 2008
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSPECTION METHOD FOR PROTECTING IMAGE SENSOR DEVICES WITH FRONT SU...
Publication number
20080113458
Publication date
May 15, 2008
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR PROTECTING IMAGE SENSOR WAFERS FROM FRONT SURFACE DAMAG...
Publication number
20080113456
Publication date
May 15, 2008
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REWORK PROCESS FOR REMOVING RESIDUAL UV ADHESIVE FROM C4 WAFER SURF...
Publication number
20080099149
Publication date
May 1, 2008
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER FRONT SIDE PROTECTION
Publication number
20080064185
Publication date
Mar 13, 2008
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Rework process for removing residual UV adhesive from C4 wafer surf...
Publication number
20070077752
Publication date
Apr 5, 2007
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CLEANING PARTICULATE FOREIGN MATTER FROM THE SURFACES OF...
Publication number
20070054115
Publication date
Mar 8, 2007
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Device For Thinning Wafers That Have Contact Bumps
Publication number
20070029045
Publication date
Feb 8, 2007
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAPE REMOVAL IN SEMICONDUCTOR STRUCTURE FABRICATION
Publication number
20060163204
Publication date
Jul 27, 2006
International Business Machines Corporation
Steven R. Codding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Application of a thermally conductive thin film to a wafer backside...
Publication number
20060105547
Publication date
May 18, 2006
International Business Machines Corporation
David M. Audette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer front side protection
Publication number
20050202678
Publication date
Sep 15, 2005
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for thinning wafers that have contact bumps
Publication number
20050106879
Publication date
May 19, 2005
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ultraviolet energy curable tape and method of making a semiconducto...
Publication number
20050104147
Publication date
May 19, 2005
International Business Machines Corporation
Timothy C. Krywanczyk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Use of photoresist in substrate vias during backside grind
Publication number
20050090110
Publication date
Apr 28, 2005
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF POLISHING C4 MOLYBDENUM MASKS TO REMOVE MOLYBDENUM PEAKS
Publication number
20050045591
Publication date
Mar 3, 2005
International Business Machines Corporation
Steven R. Codding
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor wafer front side protection
Publication number
20040209444
Publication date
Oct 21, 2004
International Business Machines Corporation
Allan D. Abrams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORROSION INHIBITOR ADDITIVES TO PREVENT SEMICONDUCTOR DEVICE BOND-...
Publication number
20040209443
Publication date
Oct 21, 2004
International Business Machines Corporation
Robert R. Cadieux
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
Use of photoresist in substrate vias during backside grind
Publication number
20040198021
Publication date
Oct 7, 2004
Donald W. Brouillette
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chemical mechanical polishing slurry and method for polishing metal...
Publication number
20010052587
Publication date
Dec 20, 2001
International Business Machines Corporation
Paul M. Feeney
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...