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Timothy F. Carden
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Vestal, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of packaging a high performance chip
Patent number
6,655,020
Issue date
Dec 2, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance chip packaging and method
Patent number
6,552,264
Issue date
Apr 22, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance chip packaging and method
Patent number
6,552,266
Issue date
Apr 22, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density design for organic chip carriers
Patent number
6,538,213
Issue date
Mar 25, 2003
International Business Machines Corporation
Timothy F. Carden
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Assembly process for flip chip package having a low stress chip and...
Patent number
6,488,806
Issue date
Dec 3, 2002
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly process for flip chip package having a low stress chip and...
Patent number
6,224,711
Issue date
May 1, 2001
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Suspension and use thereof
Patent number
4,803,100
Issue date
Feb 7, 1989
International Business Machines Corporation
Joseph G. Ameen
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
HIGH PERFORMANCE CHIP PACKAGING AND METHOD
Publication number
20020053449
Publication date
May 9, 2002
TIMOTHY F. CARDEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Assembly process for flip chip package having a low stress chip and...
Publication number
20010013392
Publication date
Aug 16, 2001
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High performance chip packaging and method
Publication number
20010009196
Publication date
Jul 26, 2001
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High performance chip packaging and method
Publication number
20010009197
Publication date
Jul 26, 2001
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS