Timothy J. Frey

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Hudson, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,956,904
- Issue date Feb 17, 2015
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 8,304,861
- Issue date Nov 6, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of substrate bonding with bonding material having rare Earth...
- Patent number 8,293,582
- Issue date Oct 23, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,288,191
- Issue date Oct 16, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 7,981,765
- Issue date Jul 19, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 7,943,411
- Issue date May 17, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20130023082
- Publication date Jan 24, 2013
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Substrate Bonding with Bonding Material Having Rare Earth...
- Publication number 20110244630
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20110241176
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20110212563
- Publication date Sep 1, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20100059835
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20100062565
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY