Timothy Leung

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 9,337,354
- Issue date May 10, 2016
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 9,082,883
- Issue date Jul 14, 2015
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 8,999,757
- Issue date Apr 7, 2015
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making thermally enhanced substrate-base package
- Patent number 7,741,158
- Issue date Jun 22, 2010
- Unisem (Mauritius) Holdings Limited
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20150315014
- Publication date Nov 5, 2015
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20140246739
- Publication date Sep 4, 2014
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20140246738
- Publication date Sep 4, 2014
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of making thermally enhanced substrate-base package
- Publication number 20070284733
- Publication date Dec 13, 2007
- Advanced Interconnect Technologies Limited, a Corporation of Mauritius.
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS