Timothy R. Webb

Follow

Person

San Mateo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plating uniformity control by contact ring shaping
- Patent number 7,025,862
- Issue date Apr 11, 2006
- Applied Materials
- Harald Herchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for planarizing metal conductive layers
- Patent number 6,770,565
- Issue date Aug 3, 2004
- Applied Materials Inc.
- Donald J. K. Olgado
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density plasma etching of metallization layer using chlorine a...
- Patent number 6,090,717
- Issue date Jul 18, 2000
- Lam Research Corporation
- Stephen F. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process for etching multicomponent alloys
- Patent number 5,779,926
- Issue date Jul 14, 1998
- Applied Materials, Inc.
- Diana Xiaobing Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Adjustable dosing algorithm for control of a copper electroplating...
- Publication number 20070089990
- Publication date Apr 26, 2007
- Joseph F. Behnke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Immersion process for electroplating applications
- Publication number 20060175201
- Publication date Aug 10, 2006
- Hooman Hafezi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating uniformity control by contact ring shaping
- Publication number 20040074761
- Publication date Apr 22, 2004
- APPLIED MATERIALS, INC.
- Harald Herchen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Oxide treatment and pressure control for electrodeposition
- Publication number 20040069651
- Publication date Apr 15, 2004
- APPLIED MATERIALS, INC.
- Harald Herchen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for planarizing metal conductive layers
- Publication number 20030129850
- Publication date Jul 10, 2003
- Applied Materials,Inc
- Donald J.K. Olgado
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...