Timothy V. Harper

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package employing flip-chip technology and metho...
- Patent number 7,002,254
- Issue date Feb 21, 2006
- Hewlett-Packard Development Company, L.P.
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for routing signals
- Patent number 6,888,227
- Issue date May 3, 2005
- Hewlett-Packard Development Company, L.P.
- James P. Slupe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package employing flip-chip technology and metho...
- Patent number 6,659,512
- Issue date Dec 9, 2003
- Hewlett-Packard Development Company, L.P.
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for routing signals
- Patent number 6,570,271
- Issue date May 27, 2003
- Hewlett-Packard Development Company, L.P.
- James P. Slupe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for testing of ball grid array circuitry
- Patent number 6,469,530
- Issue date Oct 22, 2002
- Agilent Technologies, Inc.
- Samuel Alan Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Assembly and method for constructing a multi-die integrated circuit
- Patent number 6,404,648
- Issue date Jun 11, 2002
- Hewlett-Packard Co.
- James P. Slupe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacing control in electronic device assemblies
- Patent number 5,633,535
- Issue date May 27, 1997
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package employing flip-chip technology and metho...
- Publication number 20040046263
- Publication date Mar 11, 2004
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package employing flip-chip technology and metho...
- Publication number 20040036152
- Publication date Feb 26, 2004
- Timothy V. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip integrated circuit package and method of assembly
- Publication number 20040012094
- Publication date Jan 22, 2004
- Timothy V. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for routing signals
- Publication number 20030209732
- Publication date Nov 13, 2003
- James P. Slupe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for routing signals
- Publication number 20020171127
- Publication date Nov 21, 2002
- James P. Slupe
- H01 - BASIC ELECTRIC ELEMENTS

Timothy V. Harper

Person

Patents Grantslast 30 patents

Integrated circuit package employing flip-chip technology and metho...

Apparatus for routing signals

Integrated circuit package employing flip-chip technology and metho...

Apparatus for routing signals

Method and apparatus for testing of ball grid array circuitry

Assembly and method for constructing a multi-die integrated circuit

Spacing control in electronic device assemblies

Patents Applicationslast 30 patents

Integrated circuit package employing flip-chip technology and metho...

Integrated circuit package employing flip-chip technology and metho...

Flip-chip integrated circuit package and method of assembly

Apparatus for routing signals

Apparatus for routing signals