Timothy W. Ellis

Person

Green Bay, WI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 7,199,475
- Issue date Apr 3, 2007
- Kulicke and Soffa Industries, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,885,104
- Issue date Apr 26, 2005
- Kulicke and Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board substrate
- Patent number 6,599,561
- Issue date Jul 29, 2003
- Kulicke & Soffa Investments, Inc.
- Richard Dow
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,534,877
- Issue date Mar 18, 2003
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,413,576
- Issue date Jul 2, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper band pad surface protection
- Patent number 6,352,743
- Issue date Mar 5, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-wearing impervious conductive wire clamp
- Patent number 6,156,990
- Issue date Dec 5, 2000
- Kulicke and Soffa Industries, Inc.
- Timothy W. Ellis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrafine hydrogen storage powders
- Patent number 6,074,453
- Issue date Jun 13, 2000
- Iowa State University Research Foundation, Inc.
- Iver E. Anderson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Production method for making rare earth compounds
- Patent number 5,690,889
- Issue date Nov 25, 1997
- Iowa State University Research Foundation, Inc.
- R. William McCallum
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Recycling of rare earth metals from rare earth-transition metal all...
- Patent number 5,437,709
- Issue date Aug 1, 1995
- Iowa State University Research Foundation, Inc.
- Timothy W. Ellis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of making quasicrystal alloy powder, protective coatings and...
- Patent number 5,433,978
- Issue date Jul 18, 1995
- Iowa State University Research Foundation, Inc.
- Jeffrey E. Shield
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process for depositing Cr-bearing layer
- Patent number 5,413,821
- Issue date May 9, 1995
- Iowa State University Research Foundation, Inc.
- Timothy W. Ellis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas atomization synthesis of refractory or intermetallic compounds...
- Patent number 5,368,657
- Issue date Nov 29, 1994
- Iowa State University Research Foundation, Inc.
- Iver E. Anderson
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High strength, light weight Ti-Y composites and method of making same
- Patent number 5,200,004
- Issue date Apr 6, 1993
- Iowa State University Research Foundation, Inc.
- John D. Verhoeven
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Interposer structure and method
- Publication number 20060003624
- Publication date Jan 5, 2006
- Richard M. Dow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20050181191
- Publication date Aug 18, 2005
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Woven metallic reinforcement and method of fabricating same
- Publication number 20050055933
- Publication date Mar 17, 2005
- Richard M. Dow
- E04 - BUILDING
Information Patent Application
Method for manufacturing a printed circuit board substrate with pas...
- Publication number 20040012937
- Publication date Jan 22, 2004
- Kulicke & Soffa Investments, Inc.
- David DeGrappo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20030104182
- Publication date Jun 5, 2003
- Richard Dow
- D03 - WEAVING
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020168845
- Publication date Nov 14, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding alloy composites
- Publication number 20020168538
- Publication date Nov 14, 2002
- Timothy W. Ellis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020135077
- Publication date Sep 26, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
- Publication number 20020054955
- Publication date May 9, 2002
- TIMOTHY W. ELLIS
- H01 - BASIC ELECTRIC ELEMENTS

Timothy W. Ellis

Person

Patents Grantslast 30 patents

Semiconductor copper bond pad surface protection

Semiconductor copper bond pad surface protection

Method for manufacturing a printed circuit board substrate

Semiconductor copper bond pad surface protection

Semiconductor copper bond pad surface protection

Semiconductor copper band pad surface protection

Long-wearing impervious conductive wire clamp

Ultrafine hydrogen storage powders

Production method for making rare earth compounds

Recycling of rare earth metals from rare earth-transition metal all...

Method of making quasicrystal alloy powder, protective coatings and...

Process for depositing Cr-bearing layer

Gas atomization synthesis of refractory or intermetallic compounds...

High strength, light weight Ti-Y composites and method of making same

Patents Applicationslast 30 patents

Interposer structure and method

Semiconductor copper bond pad surface protection

Woven metallic reinforcement and method of fabricating same

Method for manufacturing a printed circuit board substrate with pas...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD SUBSTRATE

Semiconductor copper bond pad surface protection

Wire-bonding alloy composites

Semiconductor copper bond pad surface protection

SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION