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Tin Kwan Chan
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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
Multiple-head wire-bonding system
Patent number
6,749,100
Issue date
Jun 15, 2004
ASM Technology Singapore PTE LTD
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Heating apparatus and method for semiconductor devices
Publication number
20050274708
Publication date
Dec 15, 2005
ASM Technology Singapore Pte Ltd
Tin Kwan Bobby Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple-head wire-bonding system
Publication number
20030098340
Publication date
May 29, 2003
ASM Technology Singapore Pte Ltd
Yam Mo Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR