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Patents Grants
last 30 patents
Information
Patent Grant
Interposer with flexible portion
Patent number
11,942,412
Issue date
Mar 26, 2024
Intel Corporation
Bok Eng Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional foldable substrate with vertical side interface
Patent number
11,758,662
Issue date
Sep 12, 2023
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wrappable EMI shields
Patent number
11,699,664
Issue date
Jul 11, 2023
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical embedded component in a printed circuit board blind hole
Patent number
11,696,409
Issue date
Jul 4, 2023
Intel Corporation
Tin Poay Chuah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System in package dual connector
Patent number
11,589,460
Issue date
Feb 21, 2023
Intel Corporation
Tin Poay Chuah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Diagonal printed circuit boards systems
Patent number
11,556,157
Issue date
Jan 17, 2023
Intel Corporation
Min Suet Lim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of forming a capacitive loop substrate assembly
Patent number
11,521,943
Issue date
Dec 6, 2022
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elevated docking station for different mobile devices
Patent number
11,487,326
Issue date
Nov 1, 2022
Intel Corporation
Jeff Ku
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
System for dual displays
Patent number
11,481,001
Issue date
Oct 25, 2022
Intel Corporation
Chee Chun Yee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Chassis interconnect for an electronic device
Patent number
11,445,608
Issue date
Sep 13, 2022
Intel Corporation
Chee How Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional foldable substrate with vertical side interface
Patent number
11,375,617
Issue date
Jun 28, 2022
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, method and system for providing recessed interconnect struc...
Patent number
11,355,427
Issue date
Jun 7, 2022
Intel Corporation
Howe Yin Loo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked scalable voltage regulator module for platform area miniatu...
Patent number
11,343,906
Issue date
May 24, 2022
Intel Corporation
Tai Loong Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Board to board interconnect
Patent number
11,304,299
Issue date
Apr 12, 2022
Intel Corporation
Chee Ling Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible printed circuit EMI enclosure
Patent number
11,178,768
Issue date
Nov 16, 2021
Intel Corporation
Khang Choong Yong
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-planar circuit board having reduced z-height
Patent number
11,172,581
Issue date
Nov 9, 2021
Intel Corporation
Eng Huat Goh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Capacitor loop structure
Patent number
11,031,359
Issue date
Jun 8, 2021
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional decoupling integration within hole in motherboard
Patent number
11,006,514
Issue date
May 11, 2021
Intel Corporation
Jia Yan Go
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded folded circuit board
Patent number
10,939,540
Issue date
Mar 2, 2021
Intel Corporation
Tin Poay Chuah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electromagnetic interference (EMI) shield for circuit card assembly...
Patent number
10,856,454
Issue date
Dec 1, 2020
Intel Corporation
Min Suet Lim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer with flexible portion
Patent number
10,840,177
Issue date
Nov 17, 2020
Intel Corporation
Bok Eng Cheah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Board to board interconnect
Patent number
10,772,206
Issue date
Sep 8, 2020
Intel Corporation
Chee Ling Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electromagnetic interference (EMI) shield
Patent number
10,701,796
Issue date
Jun 30, 2020
Intel Corporation
Tin Poay Chuah
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated connector for electronic device
Patent number
10,355,384
Issue date
Jul 16, 2019
Intel Corporation
Kit Chew Chee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Board to board interconnect
Patent number
10,356,902
Issue date
Jul 16, 2019
Intel Corporation
Chee Ling Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple-component substrate for a microelectronic device
Patent number
10,297,541
Issue date
May 21, 2019
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded package in PCB build up
Patent number
10,211,069
Issue date
Feb 19, 2019
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded package in PCB build up
Patent number
9,202,782
Issue date
Dec 1, 2015
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LAPTOP ARRANGEMENT FOR HEAT CONTROL
Publication number
20240147654
Publication date
May 2, 2024
Intel Corporation
Jiunn Shyong CHEE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP)
Publication number
20240006399
Publication date
Jan 4, 2024
Intel Corporation
Seok Ling Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE PRINTED CIRCUIT BOARDS AND DEVICES
Publication number
20240006786
Publication date
Jan 4, 2024
Intel Corporation
Howe Yin LOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH EMBEDDED CAPACITORS
Publication number
20230411385
Publication date
Dec 21, 2023
Intel Corporation
Seok Ling Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
Publication number
20230395480
Publication date
Dec 7, 2023
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
Publication number
20230397323
Publication date
Dec 7, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD ARRANGEMENT
Publication number
20230123645
Publication date
Apr 20, 2023
Intel Corporation
Tin Poay CHUAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS
Publication number
20230108868
Publication date
Apr 6, 2023
Intel Corporation
Jia Yan Go
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE
Publication number
20220369460
Publication date
Nov 17, 2022
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA PLUG CAPACITOR
Publication number
20220302007
Publication date
Sep 22, 2022
Intel Corporation
Santosh Gangal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA PLUG RESISTOR
Publication number
20220302006
Publication date
Sep 22, 2022
Intel Corporation
Santosh Gangal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
Publication number
20220174820
Publication date
Jun 2, 2022
Intel Corporation
Mooi Ling Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
Publication number
20220110214
Publication date
Apr 7, 2022
Intel Corporation
Martin M. Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS
Publication number
20220095456
Publication date
Mar 24, 2022
Intel Corporation
Arumanayagam Rajasekar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM IN PACKAGE DUAL CONNECTOR
Publication number
20220078911
Publication date
Mar 10, 2022
Intel Corporation
Tin Poay CHUAH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIAGONAL PRINTED CIRCUIT BOARDS SYSTEMS
Publication number
20220075410
Publication date
Mar 10, 2022
Intel Corporation
Min Suet LIM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEM FOR DUAL DISPLAYS
Publication number
20220066509
Publication date
Mar 3, 2022
Intel Corporation
Chee Chun YEE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ELEVATED DOCKING STATION FOR DIFFERENT MOBILE DEVICES
Publication number
20220066506
Publication date
Mar 3, 2022
Intel Corporation
Jeff KU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WRAPPABLE EMI SHIELDS
Publication number
20220068834
Publication date
Mar 3, 2022
Intel Corporation
Eng Huat GOH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RADIATION SHIELD WITH ZIPPER
Publication number
20220015272
Publication date
Jan 13, 2022
Intel Corporation
Yew San Lim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Hybrid Boards with Embedded Planes
Publication number
20210410273
Publication date
Dec 30, 2021
Intel Corporation
Jackson Chung Peng KONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RADIATION SHIELD AND GROOVE IN SUPPORT STRUCTURE
Publication number
20210410341
Publication date
Dec 30, 2021
Intel Corporation
Boon Ping Koh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ASYMMETRICAL LAMINATED CIRCUIT BOARDS FOR IMPROVED ELECTRICAL PERFO...
Publication number
20210385948
Publication date
Dec 9, 2021
Intel Corporation
Jackson Chung Peng KONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKED SCALABLE VOLTAGE REGULATOR MODULE FOR PLATFORM AREA MINIATU...
Publication number
20210385942
Publication date
Dec 9, 2021
Intel Corporation
Tai Loong Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EXPANDABLE THERMAL SOLUTION FOR LAPTOPS
Publication number
20210333848
Publication date
Oct 28, 2021
Intel Corporation
Jeff KU
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
CAPACITOR LOOP STRUCTURE
Publication number
20210233875
Publication date
Jul 29, 2021
Intel Corporation
Jenny Shio Yin ONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR POWER TUNNELS ON CIRCUIT BOARDS
Publication number
20210212205
Publication date
Jul 8, 2021
Intel Corporation
Khai Ern See
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METALLIC REGIONS TO SHIELD A MAGNETIC FIELD SOURCE
Publication number
20210144844
Publication date
May 13, 2021
Intel Corporation
Jaejin Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHASSIS INTERCONNECT FOR AN ELECTRONIC DEVICE
Publication number
20210100101
Publication date
Apr 1, 2021
Intel Corporation
Chee How Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE
Publication number
20210051801
Publication date
Feb 18, 2021
Intel Corporation
Tin Poay Chuah
H01 - BASIC ELECTRIC ELEMENTS