Ting-Hsuan Kuo

Person

Changhua County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 12,015,017
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planar transistor and FinFET
- Patent number 12,009,262
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through-via in molding compound and dielectr...
- Patent number 12,009,322
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFet) device structure and method fo...
- Patent number 11,949,014
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of fingerprint sensor
- Patent number 11,847,852
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for tuning envelope tracking system and associated processin...
- Patent number 11,777,542
- Issue date Oct 3, 2023
- Mediatek Inc.
- Ting-Hsun Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package and method
- Patent number 11,742,254
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with interconnection die and method of making same
- Patent number 11,664,315
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor
- Patent number 11,580,767
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quality of experience optimization system and method
- Patent number 11,570,063
- Issue date Jan 31, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Ta-Sung Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,527,525
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having planar transistor and FinFET
- Patent number 11,328,958
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method of manufacturing the same
- Patent number 11,309,225
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (finFET) device structure and method fo...
- Patent number 11,309,423
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,251,141
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device comprising a dichroic reflection layer having a plur...
- Patent number 11,181,778
- Issue date Nov 23, 2021
- AU OPTRONICS CORPORATION
- Ting-Yi Kuo
- G02 - OPTICS
Information Patent Grant
Package structure having sensor die with touch sensing electrode, a...
- Patent number 11,158,555
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding the strip-shaped under bump metallization struct...
- Patent number 11,049,850
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 11,011,501
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric gate pitch
- Patent number 10,957,695
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Barn Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 10,861,841
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 10,840,227
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 10,832,985
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250105084
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250087633
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...
- Publication number 20250079346
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ting Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20250014961
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...
- Publication number 20240404993
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming the Same
- Publication number 20240304535
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297163
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET
- Publication number 20240297079
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Barn CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR ENVELOPE TRACKING
- Publication number 20240178805
- Publication date May 30, 2024
- MEDIATEK INC.
- Ting-Hsun KUO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...
- Publication number 20240153821
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240112924
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20240047321
- Publication date Feb 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES
- Publication number 20230352357
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS
- Publication number 20230290747
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20230260915
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20230253300
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20230223382
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FINGERPRINT SENSOR
- Publication number 20230126259
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
- Publication number 20230110420
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415737
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS

Ting-Hsuan Kuo

Person

Patents Grantslast 30 patents

Sensor packages

Semiconductor package and manufacturing method of semiconductor pac...

Package structure with through via extending through redistribution...

Package structure, package-on-package structure and method of fabri...

Semiconductor device having planar transistor and FinFET

Package structure with through-via in molding compound and dielectr...

Fin field effect transistor (FinFet) device structure and method fo...

Semiconductor structure and method of forming the same

Manufacturing method of fingerprint sensor

Semiconductor device with multiple polarity groups

Method for tuning envelope tracking system and associated processin...

Sensor package and method

Structure with interconnection die and method of making same

Semiconductor package and manufacturing method of semiconductor pac...

Under-bump-metallization structure and redistribution layer design...

Fingerprint sensor

Quality of experience optimization system and method

Semiconductor device with multiple polarity groups

Semiconductor device having planar transistor and FinFET

Fan-out package structure and method of manufacturing the same

Fin field effect transistor (finFET) device structure and method fo...

Package structure

Display device comprising a dichroic reflection layer having a plur...

Package structure having sensor die with touch sensing electrode, a...

Methods of bonding the strip-shaped under bump metallization struct...

Package structure, package-on-package structure and method of fabri...

Asymmetric gate pitch

Semiconductor device with multiple polarity groups

Under-bump-metallization structure and redistribution layer design...

Sensor package and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

STRESS REDUCTION STRUCTURES FOR A SEMICONDUCTOR DIE IN A COMPOSITE...

GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICE INCLUDING CROSS-DIE BONDING RING AND METHODS F...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

PACKAGE STRUCTURE

Integrated Circuit Package and Methods of Forming the Same

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICE AND METHOD FOR ENVELOPE TRACKING

PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...

INTEGRATED CIRCUIT PACKAGES AND METHODS

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

SENSOR PACKAGES

HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

MANUFACTURING METHOD OF FINGERPRINT SENSOR

SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF