Ting-Kun Yeh

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 12,062,590
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of power-grounds in package structures
- Patent number 11,929,340
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipation films and manufacturing...
- Patent number 11,728,238
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package containing device dies and interconnect die and redistribut...
- Patent number 11,532,585
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,139,282
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
- Patent number 10,867,954
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect chips
- Patent number 10,720,401
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a multi-thermal interface ma...
- Patent number 10,515,869
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolyte, composition for electrolyte and lithium battery employ...
- Patent number 10,505,224
- Issue date Dec 10, 2019
- Industrial Technology Research Institute
- Ting-Ju Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging with substrates connected by conductive bumps
- Patent number 10,304,800
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 9,899,305
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance sensing apparatus and control method
- Patent number 9,501,180
- Issue date Nov 22, 2016
- MStar Semiconductor, Inc.
- Guo-Kiang Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrolyte, method for fabricating electrolyte solution, and lithi...
- Patent number 9,437,900
- Issue date Sep 6, 2016
- Industrial Technology Research Institute
- Ting-Ju Yeh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Mutual capacitive touch panel and touch control system
- Patent number 9,201,550
- Issue date Dec 1, 2015
- MStar Semiconductor, Inc.
- Guo-Kiang Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for multi-touch control and associated apparatus
- Patent number 9,134,845
- Issue date Sep 15, 2015
- MStar Semiconductor, Inc.
- Ting-Hao Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mutual-capacitance touch sensing device and electronic system inclu...
- Patent number 8,994,687
- Issue date Mar 31, 2015
- MStar Semiconductor, Inc.
- Ting-Hao Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch sensing device and electronic system including the same
- Patent number 8,922,524
- Issue date Dec 30, 2014
- MStar Semiconductor, Inc.
- Ting-Hao Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus of arranging priority queue and arbitrating fo...
- Patent number 7,694,040
- Issue date Apr 6, 2010
- VIA Technologies, Inc.
- Ting-Kun Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for discrete cosine transforms/inverse discrete c...
- Patent number 7,558,431
- Issue date Jul 7, 2009
- VIA Technologies, Inc.
- Ting-Kun Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method for memory access of sharing buses
- Patent number 7,426,620
- Issue date Sep 16, 2008
- VIA Technologies, Inc.
- Ting-Kun Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for variable length decoding
- Patent number 7,327,291
- Issue date Feb 5, 2008
- VIA Technologies, Inc.
- Roger Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method and apparatus of adaptive de-interlacing of dynamic image
- Patent number 7,206,028
- Issue date Apr 17, 2007
- VIA Technologies, Inc.
- Ting-Kun Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus of adaptive de-interlacing of dynamic image
- Patent number 7,190,405
- Issue date Mar 13, 2007
- VIA Technologies, Inc.
- Ting-Kun Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode having an adhesive layer and a reflective laye...
- Patent number 7,172,909
- Issue date Feb 6, 2007
- Epistar Corporation
- Wen-Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode having an adhesive layer and a reflective laye...
- Patent number 7,008,858
- Issue date Mar 7, 2006
- Epistar Corporation
- Wen-Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode having an adhesive layer and a reflective laye...
- Patent number 7,009,217
- Issue date Mar 7, 2006
- Epistar Corporation
- Wen-Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode having an adhesive layer and a reflective layer
- Patent number 6,987,287
- Issue date Jan 17, 2006
- Epistar Corporation
- Wen-Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode having an adhesive layer
- Patent number 6,876,005
- Issue date Apr 5, 2005
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240282589
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER, COMPOSITION, NEGATIVE ELECTRODE AND A BATTERY EMPLOYING TH...
- Publication number 20240258525
- Publication date Aug 1, 2024
- Industrial Technology Research Institute
- Guan-Lin LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of Power-Grounds in Package Structures
- Publication number 20240178177
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021442
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240021560
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS
- Publication number 20230386969
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386985
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE COMPOSITION, QUASI-SOLID ELECTROLYTE AND LITHIUM-ION BA...
- Publication number 20230352733
- Publication date Nov 2, 2023
- Industrial Technology Research Institute
- Yun-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20230124804
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230050785
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20220336321
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220310411
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT OF POWER-GROUNDS IN PACKAGE STRUCTURES
- Publication number 20220230981
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER, ELECTROLYTE, AND LITHIUM-ION BATTERY EMPLOYING THE SAME
- Publication number 20220216511
- Publication date Jul 7, 2022
- Industrial Technology Research Institute
- Jen-Chih LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE AND BATTERY
- Publication number 20220059811
- Publication date Feb 24, 2022
- Industrial Technology Research Institute
- Guan-Lin LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20210098408
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210035884
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200144155
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200035655
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20200027851
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING A MULTI-THERMAL INTERFACE MA...
- Publication number 20190371700
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTE, COMPOSITION FOR ELECTROLYTE AND LITHIUM BATTERY EMPLOY...
- Publication number 20190207255
- Publication date Jul 4, 2019
- Industrial Technology Research Institute
- Ting-Ju YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Chips
- Publication number 20190148329
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180374821
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- WEIMING CHRIS CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENIONAL NEGATIVE REFRACTION STRUCTURE AND MANUFACTURING ME...
- Publication number 20180210112
- Publication date Jul 26, 2018
- National Tsing-Hua University
- Ta-Jen Yen
- G02 - OPTICS
Information Patent Application
SOLID ELECTROLYTE AND LITHIUM BATTERY EMPLOYING THE SAME
- Publication number 20180183090
- Publication date Jun 28, 2018
- Industrial Technology Research Institute
- Ting-Ju YEH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BATTERY ELECTRODE PASTE COMPOSITION
- Publication number 20160190580
- Publication date Jun 30, 2016
- Industrial Technology Research Institute
- Jing-Pin Pan
- H01 - BASIC ELECTRIC ELEMENTS

Ting-Kun Yeh

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor package structure

Semiconductor package and manufacturing method thereof

Encapsulated package including device dies connected via interconne...

Arrangement of power-grounds in package structures

Semiconductor package with heat dissipation films and manufacturing...

Package containing device dies and interconnect die and redistribut...

Semiconductor package structure and method for manufacturing the same

Interconnect chips

Interconnect chips

Semiconductor package structure having a multi-thermal interface ma...

Electrolyte, composition for electrolyte and lithium battery employ...

Packaging with substrates connected by conductive bumps

Semiconductor package structure

Capacitance sensing apparatus and control method

Electrolyte, method for fabricating electrolyte solution, and lithi...

Mutual capacitive touch panel and touch control system

Method for multi-touch control and associated apparatus

Mutual-capacitance touch sensing device and electronic system inclu...

Touch sensing device and electronic system including the same

Method and apparatus of arranging priority queue and arbitrating fo...

Method and system for discrete cosine transforms/inverse discrete c...

Apparatus and method for memory access of sharing buses

Device and method for variable length decoding

Method and apparatus of adaptive de-interlacing of dynamic image

Method and apparatus of adaptive de-interlacing of dynamic image

Light emitting diode having an adhesive layer and a reflective laye...

Light emitting diode having an adhesive layer and a reflective laye...

Light emitting diode having an adhesive layer and a reflective laye...

Light emitting diode having an adhesive layer and a reflective layer

Light emitting diode having an adhesive layer

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

POLYMER, COMPOSITION, NEGATIVE ELECTRODE AND A BATTERY EMPLOYING TH...

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

Arrangement of Power-Grounds in Package Structures

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF

VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTROLYTE COMPOSITION, QUASI-SOLID ELECTROLYTE AND LITHIUM-ION BA...

Interconnect Chips

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ARRANGEMENT OF POWER-GROUNDS IN PACKAGE STRUCTURES

POLYMER, ELECTROLYTE, AND LITHIUM-ION BATTERY EMPLOYING THE SAME

NEGATIVE ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE AND BATTERY

Interconnect Chips

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Interconnect Chips

SEMICONDUCTOR PACKAGE STRUCTURE HAVING A MULTI-THERMAL INTERFACE MA...

ELECTROLYTE, COMPOSITION FOR ELECTROLYTE AND LITHIUM BATTERY EMPLOY...

Interconnect Chips

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE DIMENIONAL NEGATIVE REFRACTION STRUCTURE AND MANUFACTURING ME...

SOLID ELECTROLYTE AND LITHIUM BATTERY EMPLOYING THE SAME

BATTERY ELECTRODE PASTE COMPOSITION