Ting-Li Yang

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,955,423
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one via including concave port...
- Patent number 11,942,398
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with conductive via structure and method for forming...
- Patent number 11,908,790
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,588
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,017
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid micro-bump integration with redistribution layer
- Patent number 11,855,028
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having protection caps on conductive...
- Patent number 11,557,508
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated inductor with protections cap...
- Patent number 10,748,810
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,269,703
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 9,586,281
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240250019
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240096827
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method
- Publication number 20230411318
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20230395468
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20230369269
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP
- Publication number 20230154788
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230060982
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230063096
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
- Publication number 20220367347
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220274827
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bump Integration with Redistribution Layer
- Publication number 20220246565
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20220230978
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220223548
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220223550
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...
- Publication number 20220216143
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220102269
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP
- Publication number 20200381293
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP AND METHOD FOR F...
- Publication number 20190371653
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20180151493
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-YU KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20170120361
- Publication date May 4, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20160066435
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ting-Li Yang

Person

Patents Grantslast 30 patents

Bump integration with redistribution layer

Semiconductor device and method

Semiconductor device having at least one via including concave port...

Chip structure with conductive via structure and method for forming...

Semiconductor device structure and method for forming the same

Semiconductor device and method

Semiconductor device and method

Micro-electro mechanical system and manufacturing method thereof

Hybrid micro-bump integration with redistribution layer

Semiconductor device structure having protection caps on conductive...

Method of manufacturing an integrated inductor with protections cap...

Semiconductor device and method of forming the same

Forming a solder joint between metal layers

Forming a solder joint between metal layers

Patents Applicationslast 30 patents

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

Semiconductor Device and Method

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

METHOD OF FORMING SEMICONDUCTOR DEVICE

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

Bump Integration with Redistribution Layer

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

Semiconductor Device and Method

Semiconductor Device and Method

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...

Semiconductor Device and Method

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP AND METHOD FOR F...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

FORMING A SOLDER JOINT BETWEEN METAL LAYERS

FORMING A SOLDER JOINT BETWEEN METAL LAYERS