TING LIU

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Wuxi City, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413059
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Lei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD
- Publication number 20230050018
- Publication date Feb 16, 2023
- JCET GROUP CO., LTD.
- YUN GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGING STRUCTURE AND QFN PACKAGING METHOD
- Publication number 20230048687
- Publication date Feb 16, 2023
- JCET GROUP CO., LTD.
- YUN GAO
- H01 - BASIC ELECTRIC ELEMENTS