Ting Wei Chang

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Seremban, MY

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Patents Applicationslast 30 patents

Information Patent Application
CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240038637
- Publication date Feb 1, 2024
- NEXPERIA B.V.
- Jia Yunn Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20230411175
- Publication date Dec 21, 2023
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS