Ting-Yeh WU

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Hukou, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging structure with back-deposited shielding lay...
- Patent number 11,658,046
- Issue date May 23, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH BACK-DEPOSITED SHIELDING LAY...
- Publication number 20210217632
- Publication date Jul 15, 2021
- Powertech Technology Inc.
- Shih-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER DEVICE
- Publication number 20210217641
- Publication date Jul 15, 2021
- Powertech Technology Inc.
- Shih-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS