Ting-You WEI

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and package structure
- Patent number 9,786,588
- Issue date Oct 10, 2017
- VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20160172289
- Publication date Jun 16, 2016
- VIA Alliance Semiconductor Co., Ltd.
- Chen-Yueh KUNG
- H01 - BASIC ELECTRIC ELEMENTS