Ting Yu Fu

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer probe device
- Patent number 11,796,566
- Issue date Oct 24, 2023
- Winbond Electronics Corp.
- Ting-Ming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element inspection equipment and chip inspection method...
- Patent number 10,794,951
- Issue date Oct 6, 2020
- Winbond Electronics Corp.
- Ting-Ming Fu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Multi-turret handler
- Patent number 10,481,201
- Issue date Nov 19, 2019
- Winbond Electronics Corp.
- Ting-Ming Fu
- G01 - MEASURING TESTING
Information Patent Grant
Turret handler with picker pairs
- Patent number 10,401,425
- Issue date Sep 3, 2019
- Winbond Electronics Corp.
- Ting-Ming Fu
- G01 - MEASURING TESTING
Information Patent Grant
Tape and reel packing material
- Patent number 10,336,523
- Issue date Jul 2, 2019
- Winbond Electronics Corp.
- Ting-Ming Fu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Turret handler for testing electronic elements with leads
- Patent number 10,310,011
- Issue date Jun 4, 2019
- Winbond Electronics Corp.
- Ting Ming Fu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with conductive pillars having recesses or pro...
- Patent number 9,478,513
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive pillars havin...
- Patent number 8,741,764
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROBE DEVICE
- Publication number 20240003939
- Publication date Jan 4, 2024
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROBE DEVICE
- Publication number 20220120785
- Publication date Apr 21, 2022
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT INSPECTION EQUIPMENT AND CHIP INSPECTION METHOD...
- Publication number 20200096562
- Publication date Mar 26, 2020
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURRET HANDLER WITH PICKER PAIRS
- Publication number 20180238960
- Publication date Aug 23, 2018
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- G01 - MEASURING TESTING
Information Patent Application
TURRET HANDLER AND TEST METHOD THEREOF
- Publication number 20180231606
- Publication date Aug 16, 2018
- WINBOND ELECTRONICS CORP.
- Ting Ming FU
- G01 - MEASURING TESTING
Information Patent Application
MULTI-TURRET HANDLER
- Publication number 20180210028
- Publication date Jul 26, 2018
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- G01 - MEASURING TESTING
Information Patent Application
TAPE AND REEL PACKING MATERIAL
- Publication number 20180208378
- Publication date Jul 26, 2018
- WINBOND ELECTRONICS CORP.
- Ting-Ming FU
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillars Havin...
- Publication number 20130146872
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wafer probe device

Electronic element inspection equipment and chip inspection method...

Multi-turret handler

Turret handler with picker pairs

Tape and reel packing material

Turret handler for testing electronic elements with leads

Semiconductor device with conductive pillars having recesses or pro...

Semiconductor device and method of forming conductive pillars havin...

Patents Applicationslast 30 patents

WAFER PROBE DEVICE

WAFER PROBE DEVICE

ELECTRONIC ELEMENT INSPECTION EQUIPMENT AND CHIP INSPECTION METHOD...

TURRET HANDLER WITH PICKER PAIRS

TURRET HANDLER AND TEST METHOD THEREOF

MULTI-TURRET HANDLER

TAPE AND REEL PACKING MATERIAL

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

Semiconductor Device and Method of Forming Conductive Pillars Havin...