Ting-Yu Pai

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separate immersion cooling device and separate immersion cooling sy...
- Patent number 12,089,369
- Issue date Sep 10, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus, immersion cooling system and liquid amount ad...
- Patent number 12,075,599
- Issue date Aug 27, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and hinge mechanism thereof
- Patent number 12,038,793
- Issue date Jul 16, 2024
- Acer Incorporated
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus having immersion cooling system and operating...
- Patent number 11,740,669
- Issue date Aug 29, 2023
- Wiwynn Corporation
- Yi Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device assembly
- Patent number 11,681,329
- Issue date Jun 20, 2023
- Acer Incorporated
- Yu-Shih Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Immersion cooling system and electronic apparatus having the same
- Patent number 11,665,864
- Issue date May 30, 2023
- Wiwynn Corporation
- Yu-Cheng Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch pad structure
- Patent number 11,537,177
- Issue date Dec 27, 2022
- Acer Incorporated
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Foldable electronic device
- Patent number 11,425,827
- Issue date Aug 23, 2022
- Acer Incorporated
- Ting-Wen Pai
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Immersion cooling apparatus
- Patent number 11,375,638
- Issue date Jun 28, 2022
- Wiwynn Corporation
- Yuchun Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device assembly
- Patent number 11,334,115
- Issue date May 17, 2022
- Acer Incorporated
- Yu-Shih Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 11,157,046
- Issue date Oct 26, 2021
- Acer Incorporated
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Expansion device
- Patent number 11,146,031
- Issue date Oct 12, 2021
- Acer Incorporated
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic apparatus with a temperature sensor
- Patent number 11,039,554
- Issue date Jun 15, 2021
- Wiwynn Corporation
- Ting-Yu Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch pad structure
- Patent number 11,009,974
- Issue date May 18, 2021
- Acer Incorporated
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Immersion cooling module and electronic apparatus having the same
- Patent number 10,881,020
- Issue date Dec 29, 2020
- Wiwynn Corporation
- Tsung-Lin Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable fixing device for a heat dissipating component and relat...
- Patent number 10,398,022
- Issue date Aug 27, 2019
- Wiwynn Corporation
- Tsung-Han Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SERVER SYSTEM AND HEAT DISSIPATION MODULE
- Publication number 20250081404
- Publication date Mar 6, 2025
- Wiwynn Corporation
- Zi-Ping Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20250063692
- Publication date Feb 20, 2025
- Wiwynn Corporation
- Tsung-Han LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20250040039
- Publication date Jan 30, 2025
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...
- Publication number 20240381575
- Publication date Nov 14, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-FILTRATION DEVICES, COOLING SYSTEMS, AND METHOD FOR COOLING...
- Publication number 20240367178
- Publication date Nov 7, 2024
- Wiwynn Corporation
- Tai-Ying TU
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...
- Publication number 20240349452
- Publication date Oct 17, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION FLUID MODULE AND SERVER SYSTEM
- Publication number 20240251530
- Publication date Jul 25, 2024
- Wiwynn Corporation
- Zi Ping Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240064937
- Publication date Feb 22, 2024
- Wiwynn Corporation
- Chia-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...
- Publication number 20240057291
- Publication date Feb 15, 2024
- Wiwynn Corporation
- Tai-Ying Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240015929
- Publication date Jan 11, 2024
- Wiwynn Corporation
- Tai-Ying TU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240015930
- Publication date Jan 11, 2024
- Wiwynn Corporation
- Tai-Ying TU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240015926
- Publication date Jan 11, 2024
- Wiwynn Corporation
- Tai-Ying TU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW DIVIDING DEVICE, IMMERSION COOLING SYSTEM HAVING THE SAME AND...
- Publication number 20240008223
- Publication date Jan 4, 2024
- Wiwynn Corporation
- Tai-Ying Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATE IMMERSION COOLING DEVICE AND SEPARATE IMMERSION COOLING SY...
- Publication number 20230320033
- Publication date Oct 5, 2023
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20230189434
- Publication date Jun 15, 2023
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND HINGE MECHANISM THEREOF
- Publication number 20230129418
- Publication date Apr 27, 2023
- ACER INCORPORATED
- Ting-Wen PAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING SYSTEM AND ELECTRONIC APPARATUS HAVING THE SAME A...
- Publication number 20220361358
- Publication date Nov 10, 2022
- Wiwynn Corporation
- Tsung-Han Li
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSION COOLING SYSTEM AND ELECTRONIC APPARATUS HAVING THE SAME
- Publication number 20220361377
- Publication date Nov 10, 2022
- Wiwynn Corporation
- Yu-Cheng Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS HAVING IMMERSION COOLING SYSTEM AND OPERATING...
- Publication number 20220361357
- Publication date Nov 10, 2022
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH PAD STRUCTURE
- Publication number 20220342442
- Publication date Oct 27, 2022
- ACER INCORPORATED
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS, IMMERSION COOLING SYSTEM AND LIQUID AMOUNT AD...
- Publication number 20220248558
- Publication date Aug 4, 2022
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY
- Publication number 20220236766
- Publication date Jul 28, 2022
- ACER INCORPORATED
- Yu-Shih Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY
- Publication number 20210223821
- Publication date Jul 22, 2021
- ACER INCORPORATED
- Yu-Shih Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING APPARATUS
- Publication number 20210219454
- Publication date Jul 15, 2021
- Wiwynn Corporation
- YUCHUN CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH PAD STRUCTURE
- Publication number 20210151267
- Publication date May 20, 2021
- ACER INCORPORATED
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FOLDABLE ELECTRONIC DEVICE
- Publication number 20210059059
- Publication date Feb 25, 2021
- ACER INCORPORATED
- Ting-Wen Pai
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210055762
- Publication date Feb 25, 2021
- ACER INCORPORATED
- Ting-Wen PAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH PAD STRUCTURE
- Publication number 20210011565
- Publication date Jan 14, 2021
- ACER INCORPORATED
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMMERSION COOLING MODULE AND ELECTRONIC APPARATUS HAVING THE SAME
- Publication number 20200393206
- Publication date Dec 17, 2020
- Wiwynn Corporation
- Tsung-Lin Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
EXPANSION DEVICE
- Publication number 20200335924
- Publication date Oct 22, 2020
- ACER INCORPORATED
- Ting-Wen Pai
- G06 - COMPUTING CALCULATING COUNTING

Ting-Yu Pai

Person

Patents Grantslast 30 patents

Package assembly

Separate immersion cooling device and separate immersion cooling sy...

Electronic apparatus, immersion cooling system and liquid amount ad...

Electronic device and hinge mechanism thereof

Electronic apparatus having immersion cooling system and operating...

Electronic device assembly

Immersion cooling system and electronic apparatus having the same

Touch pad structure

Foldable electronic device

Immersion cooling apparatus

Electronic device assembly

Electronic device

Expansion device

Electronic apparatus with a temperature sensor

Touch pad structure

Immersion cooling module and electronic apparatus having the same

Adjustable fixing device for a heat dissipating component and relat...

Patents Applicationslast 30 patents

SERVER SYSTEM AND HEAT DISSIPATION MODULE

IMMERSION COOLING SYSTEM

PACKAGE ASSEMBLY

ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...

ELECTRO-FILTRATION DEVICES, COOLING SYSTEMS, AND METHOD FOR COOLING...

ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...

IMMERSION FLUID MODULE AND SERVER SYSTEM

IMMERSION COOLING SYSTEM

IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...

IMMERSION COOLING SYSTEM

IMMERSION COOLING SYSTEM

IMMERSION COOLING SYSTEM

FLOW DIVIDING DEVICE, IMMERSION COOLING SYSTEM HAVING THE SAME AND...

SEPARATE IMMERSION COOLING DEVICE AND SEPARATE IMMERSION COOLING SY...

PACKAGE ASSEMBLY

ELECTRONIC DEVICE AND HINGE MECHANISM THEREOF

IMMERSION COOLING SYSTEM AND ELECTRONIC APPARATUS HAVING THE SAME A...

IMMERSION COOLING SYSTEM AND ELECTRONIC APPARATUS HAVING THE SAME

ELECTRONIC APPARATUS HAVING IMMERSION COOLING SYSTEM AND OPERATING...

TOUCH PAD STRUCTURE

ELECTRONIC APPARATUS, IMMERSION COOLING SYSTEM AND LIQUID AMOUNT AD...

ELECTRONIC DEVICE ASSEMBLY

ELECTRONIC DEVICE ASSEMBLY

IMMERSION COOLING APPARATUS

TOUCH PAD STRUCTURE

FOLDABLE ELECTRONIC DEVICE

ELECTRONIC DEVICE

TOUCH PAD STRUCTURE

IMMERSION COOLING MODULE AND ELECTRONIC APPARATUS HAVING THE SAME

EXPANSION DEVICE