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Tingdong Zhou
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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Device package substrate structure and method therefor
Patent number
11,798,871
Issue date
Oct 24, 2023
NXP USA, INC.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D chip testing through micro-C4 interface
Patent number
11,193,953
Issue date
Dec 7, 2021
International Business Machines Corporation
Victor A. Garibay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module power supply
Patent number
10,765,002
Issue date
Sep 1, 2020
International Business Machines Corporation
Michael A Christo
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Substrate dielectric crack prevention using interleaved metal plane
Patent number
10,537,019
Issue date
Jan 14, 2020
NXP USA, INC.
Tingdong Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D chip testing through micro-C4 interface
Patent number
10,371,717
Issue date
Aug 6, 2019
International Business Machines Corporation
Victor A. Garibay
G01 - MEASURING TESTING
Information
Patent Grant
Electronic module power supply
Patent number
10,362,674
Issue date
Jul 23, 2019
International Business Machines Corporation
Michael A Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package materials monitor and method therefor
Patent number
10,147,654
Issue date
Dec 4, 2018
NXP USA, INC.
Stanley Andrew Cejka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module power supply
Patent number
10,080,285
Issue date
Sep 18, 2018
International Business Machines Corporation
Michael A Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple interconnections between die
Patent number
10,037,970
Issue date
Jul 31, 2018
NXP USA, INC.
David Clegg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package to board interconnect structure with built-in reference pla...
Patent number
9,974,174
Issue date
May 15, 2018
NXP USA, INC.
Robert Wenzel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
Patent number
9,972,566
Issue date
May 15, 2018
International Business Machines Corporation
Zhaoqing Chen
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
3D chip testing through micro-C4 interface
Patent number
9,726,691
Issue date
Aug 8, 2017
International Business Machines Corporation
Victor A. Garibay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
Patent number
9,646,925
Issue date
May 9, 2017
International Business Machines Corporation
Zhaoqing Chen
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Distribution of power vias in a multi-layer circuit board
Patent number
9,600,619
Issue date
Mar 21, 2017
International Business Machines Corporation
Zhaoqing Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Distribution of power vias in a multi-layer circuit board
Patent number
9,594,865
Issue date
Mar 14, 2017
International Business Machines Corporation
Zhaoqing Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Interconnect array pattern with a 3:1 signal-to-ground ratio
Patent number
9,543,241
Issue date
Jan 10, 2017
International Business Machines Corporation
Zhaoqing Chen
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Electronic module power supply
Patent number
9,456,498
Issue date
Sep 27, 2016
International Business Machines Corporation
Michael A Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reducing power grid noise in a processor while minimizing performan...
Patent number
9,146,772
Issue date
Sep 29, 2015
International Business Machines Corporation
Lee E. Eisen
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Reducing power grid noise in a processor while minimizing performan...
Patent number
9,141,421
Issue date
Sep 22, 2015
International Business Machines Corporation
Lee E. Eisen
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Method for making high-speed ceramic modules with hybrid referencin...
Patent number
8,683,413
Issue date
Mar 25, 2014
International Business Machines Corporation
Wiren Dale Becker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of attaching an electronic module power supply
Patent number
8,572,840
Issue date
Nov 5, 2013
International Business Machines Corporation
Michael A Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reducing crosstalk in the design of module nets
Patent number
8,407,644
Issue date
Mar 26, 2013
International Business Machines Corporation
Dulce M. Altabella Cabrera
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
High-speed ceramic modules with hybrid referencing scheme for impro...
Patent number
8,339,803
Issue date
Dec 25, 2012
International Business Machine Corporation
Wiren Dale Becker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Network flow based module bottom surface metal pin assignment
Patent number
8,261,226
Issue date
Sep 4, 2012
International Business Machines Corporation
Wiren Dale Becker
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Silicon interposer testing for three dimensional chip stack
Patent number
7,863,106
Issue date
Jan 4, 2011
International Business Machines Corporation
Michael Anthony Christo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for power domain optimization
Patent number
7,844,925
Issue date
Nov 30, 2010
International Business Machines Corporation
Tingdong Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flow based package pin assignment
Patent number
7,533,360
Issue date
May 12, 2009
International Business Machines Corporation
Haoxing Ren
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
Publication number
20240203911
Publication date
Jun 20, 2024
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR
Publication number
20240014114
Publication date
Jan 11, 2024
NXP USA, Inc.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR
Publication number
20220059441
Publication date
Feb 24, 2022
NXP USA, Inc.
Chee Seng Foong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE POWER SUPPLY
Publication number
20190306977
Publication date
Oct 3, 2019
International Business Machines Corporation
Michael A. Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
3D CHIP TESTING THROUGH MICRO-C4 INTERFACE
Publication number
20190265273
Publication date
Aug 29, 2019
International Business Machines Corporation
Victor A. Garibay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE POWER SUPPLY
Publication number
20190014662
Publication date
Jan 10, 2019
International Business Machines Corporation
Michael A. Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE MATERIALS MONITOR AND METHOD THEREFOR
Publication number
20180112972
Publication date
Apr 26, 2018
FREESCALE SEMICONDUCTOR, INC.
STANLEY ANDREW CEJKA
G01 - MEASURING TESTING
Information
Patent Application
PACKAGE TO BOARD INTERCONNECT STRUCTURE WITH BUILT-IN REFERENCE PLA...
Publication number
20180116050
Publication date
Apr 26, 2018
FREESCALE SEMICONDUCTOR, INC.
Robert WENZEL
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTIPLE INTERCONNECTIONS BETWEEN DIE
Publication number
20180068980
Publication date
Mar 8, 2018
FREESCALE SEMICONDUCTOR, INC.
David Clegg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CHIP TESTING THROUGH MICRO-C4 INTERFACE
Publication number
20170336440
Publication date
Nov 23, 2017
International Business Machines Corporation
Victor A. Garibay
G01 - MEASURING TESTING
Information
Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
Publication number
20170053899
Publication date
Feb 23, 2017
International Business Machines Corporation
Gerald K. Bartley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
Publication number
20170048967
Publication date
Feb 16, 2017
International Business Machines Corporation
Zhaoqing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...
Publication number
20170004923
Publication date
Jan 5, 2017
International Business Machines Corporation
Zhaoqing Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS I...
Publication number
20170006709
Publication date
Jan 5, 2017
International Business Machines Corporation
Zhaoqing Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD
Publication number
20160342723
Publication date
Nov 24, 2016
International Business Machines Corporation
Zhaoqing Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD
Publication number
20160342724
Publication date
Nov 24, 2016
International Business Machines Corporation
Zhaoqing Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ELECTRONIC MODULE POWER SUPPLY
Publication number
20160255722
Publication date
Sep 1, 2016
International Business Machines Corporation
Michael A. Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
Publication number
20160150638
Publication date
May 26, 2016
International Business Machines Corporation
Zhaoqing Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
Publication number
20160149611
Publication date
May 26, 2016
International Business Machines Corporation
Zhaoqing Chen
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLD...
Publication number
20160071822
Publication date
Mar 10, 2016
International Business Machines Corporation
Gerald K. Bartley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CHIP TESTING THROUGH MICRO-C4 INTERFACE
Publication number
20150192633
Publication date
Jul 9, 2015
International Business Machines Corporation
Victor A. Garibay
G01 - MEASURING TESTING
Information
Patent Application
REDUCING POWER GRID NOISE IN A PROCESSOR WHILE MINIMIZING PERFORMAN...
Publication number
20140157277
Publication date
Jun 5, 2014
International Business Machines Corporation
Lee E. Eisen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
REDUCING POWER GRID NOISE IN A PROCESSOR WHILE MINIMIZING PERFORMAN...
Publication number
20140157033
Publication date
Jun 5, 2014
International Business Machines Corporation
Lee E. Eisen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ELECTRONIC MODULE POWER SUPPLY
Publication number
20140029221
Publication date
Jan 30, 2014
International Business Machines Corporation
Michael A. Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MAKING HIGH-SPEED CERAMIC MODULES WITH HYBRID REFERENCIN...
Publication number
20130252379
Publication date
Sep 26, 2013
Wiren D Becker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE POWER SUPPLY
Publication number
20120081859
Publication date
Apr 5, 2012
International Business Machines Corporation
Michael A. Christo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
High-Speed Ceramic Modules with Hybrid Referencing Scheme for Impro...
Publication number
20110132650
Publication date
Jun 9, 2011
IBM Corporation
Wiren D. Becker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Reducing Crosstalk In The Design Of Module Nets
Publication number
20110031627
Publication date
Feb 10, 2011
International Business Machines Corporation
Dulce M. Altabella Cabrera
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SILICON INTERPOSER TESTING FOR THREE DIMENSIONAL CHIP STACK
Publication number
20100155888
Publication date
Jun 24, 2010
International Business Machines Corporation
Michael Anthony Christo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Auto-Router Performing Simultaneous Placement of Signal and Return...
Publication number
20090193383
Publication date
Jul 30, 2009
International Business Machines Corporation
Michael A. Christo
G06 - COMPUTING CALCULATING COUNTING