Tiruchirapalli N. Arunagiri

Person

Newark, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-deposition cleaning methods for substrates with cap layers
- Patent number 8,790,465
- Issue date Jul 29, 2014
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Processes and systems for engineering a copper surface for selectiv...
- Patent number 8,771,804
- Issue date Jul 8, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a silicon-type surface for se...
- Patent number 8,747,960
- Issue date Jun 10, 2014
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and solutions for preventing the formation of metal particu...
- Patent number 8,551,575
- Issue date Oct 8, 2013
- Lam Research
- Shijian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-deposition cleaning methods and formulations for substrates wi...
- Patent number 8,404,626
- Issue date Mar 26, 2013
- Lam Research Corporation
- Artur Kolics
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processes and systems for engineering a barrier surface for copper...
- Patent number 8,241,701
- Issue date Aug 14, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for barrier layer surface passivation
- Patent number 8,133,812
- Issue date Mar 13, 2012
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and method of manufacturing a damascene stru...
- Patent number 8,026,605
- Issue date Sep 27, 2011
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,884,017
- Issue date Feb 8, 2011
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,709,400
- Issue date May 4, 2010
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for barrier layer surface passivation
- Patent number 7,592,259
- Issue date Sep 22, 2009
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...
- Publication number 20150214093
- Publication date Jul 30, 2015
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...
- Publication number 20140322446
- Publication date Oct 30, 2014
- Yezdi Dordi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20130323410
- Publication date Dec 5, 2013
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processes and Systems for Engineering a Barrier Surface for Copper...
- Publication number 20120269987
- Publication date Oct 25, 2012
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...
- Publication number 20110306203
- Publication date Dec 15, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL METHODS FOR CLEANING POST-CMP WAFERS
- Publication number 20100136788
- Publication date Jun 3, 2010
- LAM RESEARCH CORPORATION
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Solutions for Preventing the Formation of Metal Particu...
- Publication number 20100062164
- Publication date Mar 11, 2010
- LAM RESEARCH
- Shijian Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION
- Publication number 20100009535
- Publication date Jan 14, 2010
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self assembled monolayer for improving adhesion between copper and...
- Publication number 20090304914
- Publication date Dec 10, 2009
- LAM RESEARCH CORPORATION
- Praveen Nalla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...
- Publication number 20090162537
- Publication date Jun 25, 2009
- Artur KOLICS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal methods for cleaning post-CMP wafers
- Publication number 20080280456
- Publication date Nov 13, 2008
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-limiting plating method
- Publication number 20080152823
- Publication date Jun 26, 2008
- Lam Research Corporation
- John Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and systems for barrier layer surface passivation
- Publication number 20080146025
- Publication date Jun 19, 2008
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnect structure and method of manufacturing a damascene stru...
- Publication number 20080142971
- Publication date Jun 19, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled ambient system for interface engineering
- Publication number 20080057221
- Publication date Mar 6, 2008
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM
- Publication number 20080057182
- Publication date Mar 6, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and systems for engineering a silicon-type surface for se...
- Publication number 20070292615
- Publication date Dec 20, 2007
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processes and systems for engineering a barrier surface for copper...
- Publication number 20070292603
- Publication date Dec 20, 2007
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processes and systems for engineering a copper surface for selectiv...
- Publication number 20070292604
- Publication date Dec 20, 2007
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tiruchirapalli N. Arunagiri

Person

Patents Grantslast 30 patents

Method and apparatus for wafer electroless plating

Controlled ambient system for interface engineering

Fluid handling system for wafer electroless plating and associated...

Post-deposition cleaning methods for substrates with cap layers

Processes and systems for engineering a copper surface for selectiv...

Processes and systems for engineering a silicon-type surface for se...

Methods and solutions for preventing the formation of metal particu...

Method and apparatus for wafer electroless plating

Post-deposition cleaning methods and formulations for substrates wi...

Wafer electroless plating system and associated methods

Processes and systems for engineering a barrier surface for copper...

Methods and systems for barrier layer surface passivation

Wafer electroless plating system and associated methods

Interconnect structure and method of manufacturing a damascene stru...

Thermal methods for cleaning post-CMP wafers

Thermal methods for cleaning post-CMP wafers

Methods and systems for barrier layer surface passivation

Patents Applicationslast 30 patents

PROCESSES AND SYSTEMS FOR ENGINEERING A BARRIER SURFACE FOR COPPER...

PROCESSES AND SYSTEMS FOR ENGINEERING A COPPER SURFACE FOR SELECTIV...

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

Method and Apparatus for Wafer Electroless Plating

Processes and Systems for Engineering a Barrier Surface for Copper...

Wafer Electroless Plating System and Associated Methods

INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRU...

THERMAL METHODS FOR CLEANING POST-CMP WAFERS

Methods and Solutions for Preventing the Formation of Metal Particu...

METHODS AND SYSTEMS FOR BARRIER LAYER SURFACE PASSIVATION

Self assembled monolayer for improving adhesion between copper and...

POST-DEPOSITION CLEANING METHODS AND FORMULATIONS FOR SUBSTRATES WI...

Thermal methods for cleaning post-CMP wafers

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating

Self-limiting plating method

Methods and systems for barrier layer surface passivation

Interconnect structure and method of manufacturing a damascene stru...

Controlled ambient system for interface engineering

METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM

Processes and systems for engineering a silicon-type surface for se...

Processes and systems for engineering a barrier surface for copper...

Processes and systems for engineering a copper surface for selectiv...