Tobias Hoechbauer

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a silicon carbide substrate for an electri...
- Patent number 11,721,547
- Issue date Aug 8, 2023
- Infineon Technologies AG
- Christian Hecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, laminate and method of manufacturing semiconductor devices
- Patent number 11,576,259
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor substrate
- Patent number 11,557,506
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Werner Schustereder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a silicon carbide device and wafer composit...
- Patent number 11,373,863
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer, methods...
- Patent number 11,107,732
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a silicon carbide wafer, and a silicon carbi...
- Patent number 10,903,078
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for Forming Cubic Silicon Carbide and Heterojunction Sili...
- Publication number 20240047207
- Publication date Feb 8, 2024
- Christian Zmoelnig
- C30 - CRYSTAL GROWTH
Information Patent Application
MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
- Publication number 20230127556
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF
- Publication number 20230051830
- Publication date Feb 16, 2023
- Andreas Voerckel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
- Publication number 20210159115
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Werner SCHUSTEREDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Silicon Carbide Device and Wafer Composit...
- Publication number 20200357637
- Publication date Nov 12, 2020
- Roland Rupp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20200286730
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200068709
- Publication date Feb 27, 2020
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...
- Publication number 20190362972
- Publication date Nov 28, 2019
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods...
- Publication number 20190348328
- Publication date Nov 14, 2019
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon Vacancy Defect Reduction Method for SiC
- Publication number 20170309484
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Mihai Draghici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER, A METHOD AND A PROCESSING DEVICE
- Publication number 20170032992
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Tobias Hoechbauer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A SILICON CARBIDE SUBSTRATE FOR AN ELECTRI...
- Publication number 20140264374
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Christian Hecht
- H01 - BASIC ELECTRIC ELEMENTS

Tobias Hoechbauer

Person

Patents Grantslast 30 patents

Methods for processing a wide band gap semiconductor wafer using a...

Semiconductor device with a porous portion, wafer composite and met...

Method for manufacturing a silicon carbide substrate for an electri...

Carrier, laminate and method of manufacturing semiconductor devices

Methods for processing a semiconductor substrate

Semiconductor device with a porous portion, wafer composite and met...

Method of manufacturing a silicon carbide device and wafer composit...

Methods for processing a wide band gap semiconductor wafer, methods...

Methods for processing a silicon carbide wafer, and a silicon carbi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Technique for Forming Cubic Silicon Carbide and Heterojunction Sili...

MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...

METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

Method of Manufacturing a Silicon Carbide Device and Wafer Composit...

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

CARRIER, LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...

Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods...

Carbon Vacancy Defect Reduction Method for SiC

SUBSTRATE CARRIER, A METHOD AND A PROCESSING DEVICE

METHOD FOR MANUFACTURING A SILICON CARBIDE SUBSTRATE FOR AN ELECTRI...