Tobias Jacobs

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Multi-level chip interconnect
- Patent number 9,871,017
- Issue date Jan 16, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 9,401,343
- Issue date Jul 26, 2016
- Infineon Technologies AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, and method for forming a chip arrangement
- Patent number 9,219,031
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bond pads over process control monitor structures in a semic...
- Patent number 8,994,148
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LEVEL CHIP INTERCONNECT
- Publication number 20170194288
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Peter OSSIMITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150179606
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140332953
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Bond Pads Over Process Control Monitor Structures in a Semic...
- Publication number 20140232001
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS