Tobias POLSTER

Follow

Person

Finkenstein, AT

People

Patents Applicationslast 30 patents

Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, ELECTRONIC COMPONENT AND METHOD USING LINED AND CLOSED SEPAR...
- Publication number 20230097353
- Publication date Mar 30, 2023
- INFINEON TECHNOLOGIES AG
- Oliver BLANK
- H01 - BASIC ELECTRIC ELEMENTS