Tobias Polster

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices by filling grooves fo...
- Patent number 12,094,837
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,848,237
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thin semiconductor die
- Patent number 11,605,599
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughening of a metallization layer on a semiconductor wafer
- Patent number 11,322,400
- Issue date May 3, 2022
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,302,579
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device, electronic component and met...
- Patent number 10,672,664
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BACKSIDE METALLIZATION LAYER AND A PR...
- Publication number 20240371793
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND...
- Publication number 20230197663
- Publication date Jun 22, 2023
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FO...
- Publication number 20230187381
- Publication date Jun 15, 2023
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20220181211
- Publication date Jun 9, 2022
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Thin Semiconductor Die
- Publication number 20210143108
- Publication date May 13, 2021
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Roughening of a Metallization Layer on a Semiconductor Wafer
- Publication number 20200402851
- Publication date Dec 24, 2020
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20200273750
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device, Electronic Component and Met...
- Publication number 20190088550
- Publication date Mar 21, 2019
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Tobias Polster

Person

Patents Grantslast 30 patents

Method of processing a semiconductor wafer, semiconductor die, and...

Method of manufacturing semiconductor devices by filling grooves fo...

Composite wafer, semiconductor device and electronic component

Semiconductor device having a thin semiconductor die

Roughening of a metallization layer on a semiconductor wafer

Composite wafer, semiconductor device and electronic component

Composite wafer, semiconductor device, electronic component and met...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A BACKSIDE METALLIZATION LAYER AND A PR...

METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR DIE, AND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FO...

Composite Wafer, Semiconductor Device and Electronic Component

Semiconductor Device Having a Thin Semiconductor Die

Roughening of a Metallization Layer on a Semiconductor Wafer

Composite Wafer, Semiconductor Device and Electronic Component

Composite Wafer, Semiconductor Device, Electronic Component and Met...