Tobias Schmidt

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate and a bonded substrate system
- Patent number 10,600,690
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Georg Meyer-Berg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
- Patent number 10,332,814
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate, a bonded substrate system...
- Patent number 10,056,295
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with structured sidewalls
- Patent number 9,496,193
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,293,371
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor workpiece with metallization
- Patent number 9,093,385
- Issue date Jul 28, 2015
- Infineon Technologies AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate and a Bonded Substrate System
- Publication number 20180350683
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
- Publication number 20160247739
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
- Publication number 20160218039
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150294911
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Anja Reitmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20150228607
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20140357055
- Publication date Dec 4, 2014
- INFINEON TECHNOLOGIES AG
- Anja Gissibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
- Publication number 20120068345
- Publication date Mar 22, 2012
- INFINEON TECHNOLOGIES AG
- Tobias Schmidt
- H01 - BASIC ELECTRIC ELEMENTS

Tobias Schmidt

Person

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Electronic device, electronic module and methods for fabricating th...

Electronic device, electronic module and methods for fabricating th...

Method for handling a product substrate and a bonded substrate system

Method for producing electronic device with multi-layer contact

Bonded system and a method for adhesively bonding a hygroscopic mat...

Method for handling a product substrate, a bonded substrate system...

Semiconductor chip with structured sidewalls

Electronic device with multi-layer contact

Method for processing a semiconductor workpiece with metallization

Method for processing a semiconductor workpiece with metallization

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

Method for Handling a Product Substrate and a Bonded Substrate System

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

Electronic Device with Multi-Layer Contact

BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...

Method for Handling a Product Substrate, a Bonded Substrate System...

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

METHOD FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Electronic Device and a Method for Fabricating an Electronic Device

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS