Tobias Simbeck

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil
- Publication number 20150228616
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS