Todd Balisky

Person

Corona, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Volume measurement apparatus and method
- Publication number 20050077182
- Publication date Apr 14, 2005
- APPLIED MATERIALS, INC.
- Todd A. Balisky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Point of use mixing and aging system for chemicals used in a film f...
- Publication number 20020127875
- Publication date Sep 12, 2002
- Applied Materials, Inc.
- Timothy Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Todd Balisky

Person

Patents Grantslast 30 patents

Method and apparatus for wafer electroless plating

Fluid handling system for wafer electroless plating and associated...

Method and apparatus for wafer electroless plating

Wafer electroless plating system and associated methods

Wafer electroless plating system and associated methods

Patents Applicationslast 30 patents

Method and Apparatus for Wafer Electroless Plating

Wafer Electroless Plating System and Associated Methods

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating

Volume measurement apparatus and method

Point of use mixing and aging system for chemicals used in a film f...