TREA

Todd Spencer

Follow

Person

  • Santa Clara, CA, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-chip packaging
    • Patent number 11,817,444
    • Issue date Nov 14, 2023
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip packaging
    • Patent number 11,348,911
    • Issue date May 31, 2022
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip packaging
    • Patent number 10,700,051
    • Issue date Jun 30, 2020
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20240128256
    • Publication date Apr 18, 2024
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20220231007
    • Publication date Jul 21, 2022
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20220157803
    • Publication date May 19, 2022
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20200395352
    • Publication date Dec 17, 2020
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGING
    • Publication number 20190371778
    • Publication date Dec 5, 2019
    • Intel Corporation
    • Robert L. Sankman
    • H01 - BASIC ELECTRIC ELEMENTS