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last 30 patents
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Patent Grant
Stacked die semiconductor package and method of assembly
Patent number
7,883,938
Issue date
Feb 8, 2011
United Test & Assembly Center Ltd.
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Stacked die semiconductor package and method of assembly
Publication number
20090004777
Publication date
Jan 1, 2009
United Test & Assembly Center Ltd.
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS